Invention Grant
- Patent Title: High voltage device
- Patent Title (中): 高压设备
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Application No.: US13276301Application Date: 2011-10-18
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Publication No.: US08790966B2Publication Date: 2014-07-29
- Inventor: Guowei Zhang , Purakh Raj Verma , Baofu Zhu
- Applicant: Guowei Zhang , Purakh Raj Verma , Baofu Zhu
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Horizon IP Pte Ltd
- Main IPC: H01L21/332
- IPC: H01L21/332

Abstract:
A method of forming a device is disclosed. The method includes providing a substrate having a device region. The device region includes a source region, a gate region and a drain region defined thereon. The substrate is prepared with gate layers on the substrate. The gate layers are patterned to form a gate in the gate region and a field structure surrounding the drain region. A source and a drain are formed in the source region and drain region respectively. The drain is separated from the gate on a second side of the gate and the source is adjacent to a first side of the gate. An interconnection to the field structure is formed. The interconnection is coupled to a potential which distributes the electric field across the substrate between the second side of the gate and the drain.
Public/Granted literature
- US20130093012A1 HIGH VOLTAGE DEVICE Public/Granted day:2013-04-18
Information query
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