Invention Grant
- Patent Title: Polyimide resins for high temperature applications
- Patent Title (中): 用于高温应用的聚酰亚胺树脂
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Application No.: US13823120Application Date: 2011-09-29
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Publication No.: US08795799B2Publication Date: 2014-08-05
- Inventor: Robert Ray Burch , Jesus G Moralez , Susan H Tilford
- Applicant: Robert Ray Burch , Jesus G Moralez , Susan H Tilford
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- International Application: PCT/US2011/053983 WO 20110929
- International Announcement: WO2012/050972 WO 20120419
- Main IPC: B29D22/00
- IPC: B29D22/00 ; B29D23/00 ; B32B1/08 ; B32B27/10 ; C08K3/22 ; C08L79/08 ; C08K3/00
Abstract:
Polyimide resin compositions that contain an aromatic polyimide, graphite, and acicular titanium dioxide are found to exhibit high thermal oxidative stability. Such compositions are especially useful in molded articles that are exposed to high temperatures, such as bushings, bearings, and seal rings that are used in aerospace, transportation, and materials handling applications.
Public/Granted literature
- US20130171396A1 POLYIMIDE RESINS FOR HIGH TEMPERATURE APPLICATIONS Public/Granted day:2013-07-04
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