发明授权
- 专利标题: Metal-oxide-semiconductor field-effect transistor and method for manufacturing the same
- 专利标题(中): 金属氧化物半导体场效应晶体管及其制造方法
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申请号: US13807308申请日: 2011-11-18
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公开(公告)号: US08803250B2公开(公告)日: 2014-08-12
- 发明人: Le Wang
- 申请人: Le Wang
- 申请人地址: CN Wuxi CN Wuxi
- 专利权人: CSMC Technologies FAB1 Co., Ltd.,CSMC Technologies FAB2 Co., Ltd.
- 当前专利权人: CSMC Technologies FAB1 Co., Ltd.,CSMC Technologies FAB2 Co., Ltd.
- 当前专利权人地址: CN Wuxi CN Wuxi
- 代理机构: Anova Law Group, PLLC
- 优先权: CN201010564174 20101129
- 国际申请: PCT/CN2011/082406 WO 20111118
- 国际公布: WO2012/071988 WO 20120607
- 主分类号: H01L29/02
- IPC分类号: H01L29/02 ; H01L29/66 ; H01L29/78 ; H01L29/10
摘要:
A Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) is disclosed. The MOSFET includes a substrate, a well region formed in the substrate, a shallow channel layer, a channel, a gate oxide layer, a gate region, a source region, and a drain region. The shallow channel layer is formed on a portion of the well region and includes a first shallow channel region and a second shallow channel region. The channel is arranged between the first shallow channel region and the second shallow channel region and connects the first shallow channel region and the second shallow channel region. Further, the gate oxide layer is formed on a portion of the well region between the first shallow channel region and the second shallow channel region and includes a first gate oxide region and a second gate oxide region arranged on different sides of the channel. The gate region is formed on the channel and the gate oxide layer; the source region is formed in the first shallow channel region and vertically extends into the well region under the first shallow channel region; and the drain region is formed in the second shallow channel region and vertically extends into the well region under the second shallow channel region.
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