Invention Grant
- Patent Title: Semiconductor devices comprising a plurality of gate structures
- Patent Title (中): 包括多个栅极结构的半导体器件
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Application No.: US13751679Application Date: 2013-01-28
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Publication No.: US08809146B2Publication Date: 2014-08-19
- Inventor: Daewoong Kang , Sungnam Chang , JinJoo Kim , Kyongjoo Lee , Eun-Jung Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, PA
- Priority: KR10-2005-0103107 20051031
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Methods for forming semiconductor memory structures including a gap between adjacent gate structures are provided. The methods may include forming an insulation layer between the adjacent gate structures. In some embodiments, the methods may include subsequently removing a portion of the insulation layer to leave the gap between the adjacent gate structures.
Public/Granted literature
- US20130178044A1 SEMICONDUCTOR DEVICES COMPRISING A PLURALITY OF GATE STRUCTURES Public/Granted day:2013-07-11
Information query
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