发明授权
- 专利标题： Sealed body, method for manufacturing sealed body, light-emitting device, and method for manufacturing light-emitting device
- 专利标题（中）： 密封体，密封体的制造方法，发光装置以及发光装置的制造方法
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申请号： US13523435申请日： 2012-06-14
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公开(公告)号： US08816336B2公开(公告)日： 2014-08-26
- 发明人: Akihisa Shimomura
- 申请人： Akihisa Shimomura
- 申请人地址： JP
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP
- 代理机构： Husch Blackwell LLP
- 优先权： JP2011-133957 20110616
- 主分类号： H01L29/08
- IPC分类号： H01L29/08
摘要：
A highly productive method for sealing substrates with the use of glass frit is provided. A method for sealing substrates with the use of glass frit, which can be used for a substrate provided with a material having low heat resistance, is provided. A highly airtight sealed body which is manufactured by such a method is provided. A light-emitting device having high productivity and high reliability and a manufacturing method thereof are provided. A heat generation layer containing a conductive material which generates heat by induction heating is formed to overlap with a region where a paste including a frit material and a binder is applied. Alternatively, a conductive material which generates heat by induction heating is added to the paste itself. The paste is locally heated by induction heating to remove the binder included in the paste.