A power semiconductor device includes a four-layer structure having layers arranged in order: (i) a cathode layer of a first conductivity type with a central area being surrounded by a lateral edge, the cathode layer being in direct electrical contact with a cathode electrode, (ii) a base layer of a second conductivity type, (iii) a drift layer of the first conductivity typehaving a lower doping concentration than the cathode layer, and (iv) an anode layer of the second conductivity type which is in electrical contact with an anode electrode. The base layer includes a first layer as a continuous layer contacting the central area of the cathode layer. A resistance reduction layer, in which the resistance at the junction between the lateral edge of the cathode and base layers is reduced, is arranged between the first layer and the cathode layer and covers the lateral edge of the cathode layer.