发明授权
- 专利标题: Base for power module
- 专利标题(中): 电源模块基座
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申请号: US13352681申请日: 2012-01-18
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公开(公告)号: US08824144B2公开(公告)日: 2014-09-02
- 发明人: Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
- 申请人: Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
- 申请人地址: JP Kariya-shi JP Tokyo
- 专利权人: Kabushiki Kaisha Toyota Jidoshokki,Showa Denko K.K.
- 当前专利权人: Kabushiki Kaisha Toyota Jidoshokki,Showa Denko K.K.
- 当前专利权人地址: JP Kariya-shi JP Tokyo
- 代理机构: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2006-067223 20060313
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; H01L23/34 ; F28F7/00
摘要:
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
公开/授权文献
- US20120113598A1 BASE FOR POWER MODULE 公开/授权日:2012-05-10