利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

23 条记录 (耗时 0.028 秒)

    BASE FOR POWER MODULE
    1.
    发明申请
    BASE FOR POWER MODULE 有权
    电源模块

    公开(公告)号：US20100002397A1

    公开(公告)日：2010-01-07

    申请号：US12282729

    申请日：2007-03-08

    申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

    摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且能够将诸如壳体的功率模块所需的各种部件附接到部件安装板上。

    Base for power module
    2.
    发明授权
    Base for power module 有权
    电源模块基座

    公开(公告)号：US08824144B2

    公开(公告)日：2014-09-02

    申请号：US13352681

    申请日：2012-01-18

    申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

    CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

    摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。

    BASE FOR POWER MODULE
    3.
    发明申请
    BASE FOR POWER MODULE 有权
    电源模块

    公开(公告)号：US20120113598A1

    公开(公告)日：2012-05-10

    申请号：US13352681

    申请日：2012-01-18

    申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    IPC分类号： H05K7/20

    CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

    摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。

    Base for power module
    4.
    发明授权
    Base for power module 有权
    电源模块基座

    公开(公告)号：US08102652B2

    公开(公告)日：2012-01-24

    申请号：US12282729

    申请日：2007-03-08

    申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

    IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

    CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

    摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且能够将诸如壳体的功率模块所需的各种部件附接到部件安装板上。

    Semiconductor module
    5.
    发明授权
    Semiconductor module 有权
    半导体模块

    公开(公告)号：US07923833B2

    公开(公告)日：2011-04-12

    申请号：US12086715

    申请日：2006-12-11

    申请人： Yuichi Furukawa ,  Shinobu Yamauchi ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Keiji Toh ,  Eiji Kono ,  Kota Otoshi ,  Katsufumi Tanaka

    发明人： Yuichi Furukawa ,  Shinobu Yamauchi ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Keiji Toh ,  Eiji Kono ,  Kota Otoshi ,  Katsufumi Tanaka

    IPC分类号： H01L23/06

    CPC分类号： H01L23/3735 ,  H01L23/367 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

    摘要： A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

    摘要翻译： 半导体模块10包括陶瓷基板，其具有安装有半导体元件12的前表面和在前表面的相对侧上的后表面，与前表面接合的前金属板15，后金属板16接合 后部金属板16包括面向散热片13的接合面16b。接合面16b包括接合区域和非接合区域。 非接合区域包括在后金属板16的厚度方向上延伸的凹部18.后金属板16的接合面积在接合面16b的总面积的65％〜85％的范围内 后金属板16.结果，可以在发生由于热应力引起的变形和开裂的同时实现优异的散热性能。

    Heat sink for power module
    6.
    发明授权
    Heat sink for power module 失效
    电源模块散热片

    公开(公告)号：US08387685B2

    公开(公告)日：2013-03-05

    申请号：US11919368

    申请日：2006-04-19

    申请人： Masahiko Kimbara ,  Keiji Toh ,  Hidehito Kubo ,  Katsufumi Tanaka ,  Kota Otoshi ,  Eiji Kono ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    发明人： Masahiko Kimbara ,  Keiji Toh ,  Hidehito Kubo ,  Katsufumi Tanaka ,  Kota Otoshi ,  Eiji Kono ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    IPC分类号： F28F7/00 ,  F28F3/12

    CPC分类号： H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  H01L23/3731 ,  H01L23/3736 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.

    摘要翻译： 提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。 用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分 面22对层叠方向的各平行流路50形成传热路径70a。 在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合 主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂 流路由流入路径30a，每个平行流路50和流出路径40a构成。

    HEAT SINK FOR POWER MODULE
    8.
    发明申请
    HEAT SINK FOR POWER MODULE 失效
    电源模块散热器

    公开(公告)号：US20090314474A1

    公开(公告)日：2009-12-24

    申请号：US11919368

    申请日：2006-04-19

    申请人： Masahiko Kimbara ,  Keiji Toh ,  Hidehito Kubo ,  Katsufumi Tanaka ,  Kota Otoshi ,  Eiji Kono ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    发明人： Masahiko Kimbara ,  Keiji Toh ,  Hidehito Kubo ,  Katsufumi Tanaka ,  Kota Otoshi ,  Eiji Kono ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F3/12

    CPC分类号： H01L23/473 ,  F28F3/086 ,  F28F3/12 ,  H01L23/3731 ,  H01L23/3736 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014

    摘要： A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.

    摘要翻译： 提供了能够实现进一步提高散热性能的功率模块的散热器，并且进一步提高了安装特性。 用于功率模块的散热器1具有层叠体20，第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21，多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分 面22对层叠方向的各平行流路50形成传热路径70a。 在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a，26b接合 主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂 流路由流入路径30a，每个平行流路50和流出路径40a构成。

    Heat Sink For Power Module
    9.
    发明申请
    Heat Sink For Power Module 失效
    功率模块散热片

    公开(公告)号：US20090302458A1

    公开(公告)日：2009-12-10

    申请号：US11922945

    申请日：2006-06-27

    申请人： Hidehito Kubo ,  Masahiko Kimbara ,  Keiji Toh ,  Kota Otoshi ,  Eiji Kono ,  Katsufumi Tanaka ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    发明人： Hidehito Kubo ,  Masahiko Kimbara ,  Keiji Toh ,  Kota Otoshi ,  Eiji Kono ,  Katsufumi Tanaka ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Yuichi Furukawa ,  Shinobu Yamauchi

    IPC分类号： H01L23/367 ,  H05K7/20

    CPC分类号： H05K7/20263 ,  F28F3/027 ,  H01L23/3672 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.

    摘要翻译： 用于功率模块的散热器（1）能够将功率器件（101）安装在散热器的至少一个表面上。 散热器包括散发由动力装置（101）产生的热量的冷却介质流动的制冷剂通路（1d）和布置在制冷剂通路（1d）中的波纹状散热片体（1a）。 波纹状散热片体（1a）具有在冷却介质的流动方向上延伸的波峰（21b）和槽（21c），以及各个顶部（21b）的相应一个与相邻的顶部 一个槽（21c）。 布置在相邻侧壁（21a）之间的每个相邻的一对侧壁（21a）和相应的一个峰（21b）或相应的一个槽（21c）形成翅片（21）。 每个侧壁（21a）具有操作以使至少旋转在相关联的翅片（21）中流动的冷却介质的百叶窗（31）。 因此，散热器（1）具有进一步改善的散热性能。