公开(公告)号：US09406585B2

公开(公告)日：2016-08-02

申请号：US12546423

申请日：2009-08-24

申请人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28F3/12 ,  H01L23/473 ,  H01L21/48 ,  F28F3/02

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L21/4882 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing which has a cooling-liquid inlet formed at a rear end portion of the casing and a cooling-liquid outlet formed at a front end portion of the casing. A corrugated fin for forming a plurality of flow channels through which a cooling liquid flows from the rear side toward the front side is disposed within the casing to be located between the cooling-liquid inlet and the cooling-liquid outlet. A heat-generating-body mounting region is provided on an outer surface of a top wall of the casing. Projections which come into contact with front and rear end portions of the corrugated fin to thereby position the corrugated fin in the front-rear direction are provided on an inner surface of the bottom wall of the casing at positions shifted, in the left-right direction, from an inner surface region corresponding to the heat-generating-body mounting region.

摘要翻译： 液冷式冷却装置包括壳体，其具有形成在壳体的后端部的冷却液入口和形成在壳体的前端部的冷却液出口。 用于形成冷却液从后侧朝向前侧流过的多个流路的波纹状散热片设置在壳体内，位于冷却液入口与冷却液出口之间。 发热体安装区域设置在壳体顶壁的外表面上。 与波纹状散热片的前端部和后端部接触，从而将波纹状散热片朝前后方向定位的突出部设置在壳体的底壁的内表面上，在左右方向 从对应于发热体安装区域的内表面区域。

公开(公告)号：US09159645B2

公开(公告)日：2015-10-13

申请号：US12546149

申请日：2009-08-24

申请人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

发明人： Shogo Mori ,  Hideyasu Obara ,  Taizo Kuribayashi ,  Shinobu Tamura

IPC分类号： F28F7/00 ,  H01L23/473 ,  F28F3/02 ,  F28F3/12

CPC分类号： H01L23/473 ,  F28F3/025 ,  F28F3/12 ,  F28F2265/32 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid-cooled-type cooling device includes a casing having a cooling-liquid inlet and a cooling-liquid outlet. A fin for forming flow channels is disposed within the casing between the inlet and the outlet. A portion of the interior of the casing located rearward of the fin is an inlet header section, and a portion of the interior of the casing located frontward of the fin is an outlet header section. A rear side surface within the inlet header section is skewed toward the fin in a direction from the right side toward the left side. A positioning vertical surface extending straight along the left-right direction and positioning a rear end portion of the fin is provided on a lower portion of a left end portion of the rear side surface within the inlet header section. The rear end portion of the fin is in contact with the positioning vertical surface.

摘要翻译： 液冷式冷却装置包括具有冷却液入口和冷却液出口的壳体。 用于形成流动通道的翅片设置在壳体内的入口和出口之间。 位于翅片后方的壳体内部的一部分是入口集管部分，并且位于翅片前方的壳体内部的一部分是出口集管部分。 入口集管部分内的后侧表面在从右侧向左侧的方向上朝翅片倾斜。 在入口集管部分中的后侧表面的左端部的下部设置有沿着左右方向直线延伸并且定位翅片的后端部的定位垂直表面。 翅片的后端部与定位垂直面接触。

公开(公告)号：US09069324B2

公开(公告)日：2015-06-30

申请号：US14011372

申请日：2013-08-27

申请人： Shogo Mori

发明人： Shogo Mori

IPC分类号： G03G21/16

CPC分类号： G03G21/1633 ,  G03G21/1628 ,  G03G21/1666

摘要： An image forming apparatus including: a body frame including an opening; a cover configured to rotate between an open position where the cover opens the opening and a closed position where the cover closes the opening and including a base end portion rotatably supported by the body frame and a distal end portion; an exposure member supported by the cover and configured to swing when the cover is rotated from the closed position to the open position; a cable configured to transmit current to the exposure member; and a metal plate fixed to the cover and having a through-hole through which the cable extends, the metal plate including, a main body part, and a conduction part protruding, toward the exposure member, from the main body part adjacent to the through-hole at the distal end side of the cover.

摘要翻译： 一种图像形成装置，包括：主体框架，包括开口; 盖构造成在盖打开开口的打开位置和盖关闭开口的关闭位置之间旋转，并且包括由主体框架可旋转地支撑的基端部分和远端部分; 所述曝光构件由所述盖支撑并且构造成当所述盖从所述关闭位置旋转到所述打开位置时摆动; 配置为将电流传输到曝光构件的电缆; 以及金属板，其固定到所述盖并具有所述电缆延伸穿过的通孔，所述金属板包括主体部和导电部，所述主体部和导电部从所述主体部朝向所述曝光部突出， 在盖的远端侧的孔。

公开(公告)号：US08953978B2

公开(公告)日：2015-02-10

申请号：US13623519

申请日：2012-09-20

申请人： Shogo Mori ,  Takuya Yamaguchi

发明人： Shogo Mori ,  Takuya Yamaguchi

IPC分类号： G03G21/16

CPC分类号： G03G21/16 ,  G03G21/1633 ,  G03G2221/1678 ,  H04N1/00551 ,  H04N1/00554 ,  H04N1/00559 ,  H04N2201/0082

摘要： An image forming apparatus includes: a rotary member which rotates with respect to an apparatus main body between a first position and a second position; and a buffering member connected to the apparatus main body and the rotary member for buffering an impact attributable to the rotation of the rotary member. The buffering member includes: a hollow member; a movable member moveable between an evacuation position and an advance position; and a slide member provided to the movable member and contactable with an inner circumferential surface of the hollow member. The slide member is deformable such that a first pressure on the hollow member when the rotary member rotates from the first position to the second position is larger than a second pressure on the hollow member when the rotary member rotates from the second position to the first position.

摘要翻译： 图像形成装置包括：旋转构件，其相对于装置主体在第一位置和第二位置之间旋转; 以及缓冲构件，其连接到装置主体和旋转构件，用于缓冲由旋转构件的旋转引起的冲击。 缓冲构件包括：中空构件; 可移动构件，其可在排气位置和提前位置之间移动; 以及滑动构件，其设置在所述可动构件上并与所述中空构件的内周面接触。 滑动构件是可变形的，使得当旋转构件从第一位置旋转到第二位置时，中空构件上的第一压力大于当旋转构件从第二位置旋转到第一位置时的中空构件上的第二压力 。

公开(公告)号：US08824144B2

公开(公告)日：2014-09-02

申请号：US13352681

申请日：2012-01-18

申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

IPC分类号： H05K7/20 ,  H01L23/34 ,  F28F7/00

CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。

公开(公告)号：US08584483B2

公开(公告)日：2013-11-19

申请号：US13069933

申请日：2011-03-23

申请人： Shogo Mori

发明人： Shogo Mori

IPC分类号： F25D17/04

CPC分类号： F28F19/01 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device includes a refrigerant inlet, a refrigerant outlet, a cooler including therein a refrigerant passage, an introduction tube communicating with the refrigerant inlet and a filter detachably disposed between the refrigerant inlet and the introduction tube.

摘要翻译： 冷却装置包括制冷剂入口，制冷剂出口，其中包括制冷剂通道的冷却器，与制冷剂入口连通的引入管和可拆卸地设置在制冷剂入口和引入管之间的过滤器。

公开(公告)号：US08564868B2

公开(公告)日：2013-10-22

申请号：US13051016

申请日：2011-03-18

申请人： Shinya Kusuda ,  Shogo Mori

发明人： Shinya Kusuda ,  Shogo Mori

IPC分类号： G02B26/08

CPC分类号： G02B26/121 ,  B41J2/471 ,  B41J29/02 ,  H04N1/1135 ,  H04N1/12 ,  H04N2201/0082

摘要： A light scanning apparatus includes: a light source configured to emit a light beam; a deflector configured to deflect and scan the light beam from the light source in a main scanning direction; a control substrate that is configured to control driving of the light source and includes a first connection part to which the light source is connected and a second connection part for connecting an external terminal; and a housing that supports the control substrate. The first connection part is arranged within the housing and the second connection part is exposed and arranged at the outside of the housing.

摘要翻译： 光扫描装置包括：被配置为发射光束的光源; 偏转器，被构造成在主扫描方向上偏转和扫描来自光源的光束; 控制基板，被配置为控制所述光源的驱动，并且包括连接有所述光源的第一连接部和用于连接外部端子的第二连接部; 以及支撑控制基板的壳体。 第一连接部分布置在壳体内，第二连接部分暴露并布置在壳体的外部。

公开(公告)号：US08299606B2

公开(公告)日：2012-10-30

申请号：US13361446

申请日：2012-01-30

申请人： Shogo Mori ,  Eiji Kono ,  Keiji Toh

发明人： Shogo Mori ,  Eiji Kono ,  Keiji Toh

IPC分类号： H01L23/10 ,  H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device is provided that may include an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, and a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate. The heat sink may include a housing that is made of a metal sheet and radiating fins that are fixed in the housing and made of aluminum. The metal sheet may have a coefficient of thermal expansion between those of the insulating substrate and the radiating fin.

摘要翻译： 提供一种半导体器件，其可以包括具有陶瓷衬底和在陶瓷衬底的相对表面上的金属涂层的绝缘衬底，安装在绝缘衬底的一个表面上的半导体芯片和直接或间接固定到另一个的散热器 绝缘基板的表面，并通过绝缘基板热连接到半导体芯片。 散热器可以包括由金属板制成的壳体和固定在壳体中并由铝制成的散热片。 金属片可以具有绝缘基板和散热片之间的热膨胀系数。

公开(公告)号：US08283773B2

公开(公告)日：2012-10-09

申请号：US12698183

申请日：2010-02-02

申请人： Shogo Mori ,  Eiji Kono ,  Keiji Toh

发明人： Shogo Mori ,  Eiji Kono ,  Keiji Toh

IPC分类号： H01L23/06 ,  H01L23/15 ,  H01L23/10 ,  H01L23/34

CPC分类号： H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes an insulating substrate having a ceramic substrate and metal coating layers on opposite surfaces of the ceramic substrate, a semiconductor chip mounted on one surface of the insulating substrate, a heat sink directly or indirectly fixed to the other surface of the insulating substrate and thermally connected to the semiconductor chip through the insulating substrate and at least one anti-warping sheet disposed on at least one surface of the heat sink. The anti-warping sheet is made of a metal sheet having a coating layer and has coefficient of thermal expansion between those of the insulating substrate and the heat sink.

摘要翻译： 半导体器件包括：绝缘基板，具有陶瓷基板和在陶瓷基板的相对表面上的金属涂层，安装在绝缘基板的一个表面上的半导体芯片，直接或间接地固定到绝缘基板的另一个表面的散热片 并且通过所述绝缘基板与所述半导体芯片热连接，以及设置在所述散热器的至少一个表面上的至少一个抗翘曲板。 防翘曲片由具有涂层的金属片制成，并且在绝缘基板和散热片之间具有热膨胀系数。

公开(公告)号：US20120113598A1

公开(公告)日：2012-05-10

申请号：US13352681

申请日：2012-01-18

申请人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

发明人： Keiji Toh ,  Shogo Mori ,  Hideyasu Obara ,  Nobuhiro Wakabayashi ,  Shintaro Nakagawa ,  Shinobu Yamauchi

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4006 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。