发明授权
US08829657B2 Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package
有权
半导体衬底,具有该半导体衬底的半导体芯片和堆叠的半导体封装
- 专利标题: Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package
- 专利标题(中): 半导体衬底,具有该半导体衬底的半导体芯片和堆叠的半导体封装
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申请号: US13614924申请日: 2012-09-13
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公开(公告)号: US08829657B2公开(公告)日: 2014-09-09
- 发明人: Hyun Joo Kim , Kang Won Lee , Gyu Jei Lee
- 申请人: Hyun Joo Kim , Kang Won Lee , Gyu Jei Lee
- 申请人地址: KR Gyeonggi-do
- 专利权人: SK Hynix Inc.
- 当前专利权人: SK Hynix Inc.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: William Park & Associates Patent Ltd.
- 优先权: KR10-2012-0035278 20120405
- 主分类号: H01L29/06
- IPC分类号: H01L29/06
摘要:
A semiconductor substrate includes a substrate body divided into device regions and a peripheral region outside the device region, and having one surface, another surface substantially facing away from the one surface, trenches defined in the device regions under the one surface and inner surfaces which are formed due to defining of the trenches; active regions formed in the trenches; and a gettering layer formed between the inner surfaces of the substrate body and the active regions.
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