Invention Grant
US08829657B2 Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package
有权
半导体衬底，具有该半导体衬底的半导体芯片和堆叠的半导体封装
- Patent Title: Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package
- Patent Title (中): 半导体衬底，具有该半导体衬底的半导体芯片和堆叠的半导体封装
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Application No.: US13614924Application Date: 2012-09-13
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Publication No.: US08829657B2Publication Date: 2014-09-09
- Inventor: Hyun Joo Kim , Kang Won Lee , Gyu Jei Lee
- Applicant: Hyun Joo Kim , Kang Won Lee , Gyu Jei Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Patent Ltd.
- Priority: KR10-2012-0035278 20120405
- Main IPC: H01L29/06
- IPC: H01L29/06
Abstract:
A semiconductor substrate includes a substrate body divided into device regions and a peripheral region outside the device region, and having one surface, another surface substantially facing away from the one surface, trenches defined in the device regions under the one surface and inner surfaces which are formed due to defining of the trenches; active regions formed in the trenches; and a gettering layer formed between the inner surfaces of the substrate body and the active regions.
Public/Granted literature
- US20130264689A1 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR CHIP HAVING THE SAME, AND STACKED SEMICONDUCTOR PACKAGE Public/Granted day:2013-10-10
Information query
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