摘要:
There are provided a network security state visualization device and method, the device including: a security event collector collecting original security event information from network security apparatuses; a security event analyzer analyzing the original security event information collected by the security event collector and extracting characteristic data corresponding to a security event; and a three-dimensional visualization display unit visualizing a correlation between the characteristic data extracted by the security event analyzer as a three-dimensional screen to be displayed.
摘要:
A system for defending against a distributed denial-of-service attack includes an intrusion detection system, an active security management system and an active security node. The intrusion detection system generates alert data if a denial-of-service attack is detected. The active security management system manages a domain, analyzes the alert data, generates and transmits a backtracking sensor in a case of the distributed denial-of-service attack, transmits mobile sensors to a host backtracked by the backtracking sensor to remove a master or an agent program within the host; and generates and transmits a backtracking sensor by using an IP address of a host that has transmitted a packet to the removed master or agent program. The active security node executes the transmitted backtracking sensor to backtrack an attacking host of the distributed denial-of-service attack and, if the backtracked host is determined as a real attacker, intercepts a traffic generated from the real attacker.
摘要:
A method of controlling contamination in a substrate transfer chamber that is disposed between a load port for supporting a container to receive a plurality of substrates and a substrate process module for processing the substrates includes supplying a purge gas into the substrate transfer chamber to purge an interior of the substrate transfer chamber, circulating the purge gas supplied into the substrate transfer chamber through a gas circular pipe, removing particles and airborne molecular contaminants from the purge gas being circulated, and resupplying the circulated purge gas into the substrate transfer chamber.
摘要:
The present invention relates to a seismic isolation device, including: a sliding platform (100) having a sliding surface (120) of a downwardly concave spherical shape formed on an upper surface thereof; and a sliding body (200) placed on the sliding surface (120) being capable of sliding on the sliding surface (120) by means of a sliding means, wherein the sliding body (200) slides on the sliding surface (120) in a situation where an earthquake occurs to effectively absorb vibrations applied to a structure, such that the structure can be safely protected.
摘要:
An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
摘要:
An apparatus and method for improving the performance of a determination of whether an earphone is mounted to a portable terminal, such as a portable terminal supporting a 3.5 mm earphone plug, are provided. An apparatus for recognizing whether the earphone is mounted to the portable terminal includes a common ground terminal and a switching terminal of an earphone plug receptacle for electrically connecting to each other and the same pole of an earphone plug when the earphone plug is mounted in the earphone plug receptacle, and an external output managing unit for generating an earphone mounting notification signal through a detector.
摘要:
Analysis of an electromagnetic wave traveling in an optical device, can be performed quickly and correctly. A structure forming process simulator forms an analysis structure of a physical object to be analyzed. A hybrid optical simulator calculates time-independent data and time-dependent data of an electromagnetic field by dividing the analysis structure into parts, determining whether a metallic or magnetic material is included in each of the divided parts, and selectively applying a Beam Propagation Method (BPM) or a Finite Difference Time Domain (FDTD) method to the divided parts. A storage device stores the time-independent data and the time-dependent data output from the hybrid optical simulator as hybrid electric field data. Related methods are also described.
摘要:
An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
摘要:
A semiconductor chip includes a semiconductor substrate having one surface, an other surface which faces away from the one surface, and through holes which pass through the one surface and the other surface; through electrodes filled in the through holes; and a gettering layer formed of polysilicon interposed between the through electrodes and inner surfaces of the semiconductor substrate whose form is defined by the through holes.