发明授权
- 专利标题： PCB terminal and method for manufacturing the same
- 专利标题（中）： PCB端子及其制造方法
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申请号： US13312546申请日： 2011-12-06
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公开(公告)号： US08835771B2公开(公告)日： 2014-09-16
- 发明人: Yasushi Masago , Koichi Taira , Toshiyuki Mitsui , Junichi Kakumoto , Masayasu Nishimura
- 申请人： Yasushi Masago , Koichi Taira , Toshiyuki Mitsui , Junichi Kakumoto , Masayasu Nishimura
- 申请人地址： JP Kobe-shi
- 专利权人： Kobe Steel, Ltd.
- 当前专利权人： Kobe Steel, Ltd.
- 当前专利权人地址： JP Kobe-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2010-272088 20101207
- 主分类号： H05K1/02
- IPC分类号： H05K1/02 ; H01R12/55 ; H01R13/03 ; C25D5/10
摘要：
The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.
公开/授权文献
- US20120138330A1 PCB TERMINAL AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2012-06-07
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