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公开(公告)号：US20120138330A1
公开(公告)日：2012-06-07
申请号：US13312546
申请日：2011-12-06
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.
摘要翻译： 本发明在PCB端子中形成具有适当可控平面形状的Sn涂层和Cu-Sn合金涂层。 形成作为多个基本上平行的多个Sn层的一组Sn涂层作为表面被覆层，并且Cu-Sn合金涂层2暴露在构成Sn组的Sn涂层两侧的最外表面上 涂层。 Sn被覆层的宽度为1〜500μm，相邻的Sn被覆层的间隔为1〜20000μm，端子插入方向的最外侧的最高高度粗糙度为10μm以下。
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公开(公告)号：US07928541B2
公开(公告)日：2011-04-19
申请号：US12363974
申请日：2009-02-02
申请人： Yosuke Miwa , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
发明人： Yosuke Miwa , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
IPC分类号： H01L23/495
CPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , H01L2924/0002 , H01L2924/00
摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者 或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。 在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。
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公开(公告)号：US08835771B2
公开(公告)日：2014-09-16
申请号：US13312546
申请日：2011-12-06
CPC分类号： H01R12/55 , C25D5/10 , H01R13/03 , Y10T29/49224
摘要： The invention forms a Sn coating layer and a Cu—Sn alloy coating layer having a suitably controllable planar shape in a PCB terminal. A group of Sn coating layers being as a plurality of essentially parallel lines is formed as the surface coating layer, and a Cu—Sn alloy coating layer 2 is exposed on the outermost surface on both sides of Sn coating layers each constituting the group of Sn coating layers. The Sn coating layers have a width of 1 to 500 μm, an interval between adjacent Sn coating layers is 1 to 20000 μm, and an outermost maximum height roughness in a terminal insertion direction is at most 10 μm.
摘要翻译： 本发明在PCB端子中形成具有适当可控平面形状的Sn涂层和Cu-Sn合金涂层。 形成作为多个基本上平行的多个Sn层的一组Sn涂层作为表面被覆层，并且Cu-Sn合金涂层2暴露在构成Sn组的Sn涂层两侧的最外表面上 涂层。 Sn被覆层的宽度为1〜500μm，相邻的Sn被覆层的间隔为1〜20000μm，端子插入方向的最外侧的最高高度粗糙度为10μm以下。
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公开(公告)号：US20090224379A1
公开(公告)日：2009-09-10
申请号：US12363974
申请日：2009-02-02
申请人： Yosuke MIWA , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
发明人： Yosuke MIWA , Masayasu Nishimura , Ryoichi Ozaki , Shinya Katsura
CPC分类号： C22C9/00 , C22C9/02 , C22C9/04 , C22C9/06 , H01L2924/0002 , H01L2924/00
摘要： A QFN package is provided with a lead frame formed by processing a copper alloy sheet containing 0.01 to 0.50% by mass Fe, 0.01 to 0.20% by mass P, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below, or a copper alloy sheet containing 0.05 to 2% by mass Ni, 0.001 to 0.3% by mass P, 0.005 to 5% by mass Zn, and Cu and inevitable impurities as other components, having a micro Vickers hardness of 150 or above, a uniform elongation of 5% or below and a local elongation of 10% or below. Lead burrs formed during the dicing of the QFN package are short, and a dicing blade used for dicing the QFN package is abraded at a low wear-out rate.
摘要翻译： QFN封装具有通过加工含有0.01〜0.50质量％Fe，0.01〜0.20质量％P的铜合金板和作为其他成分的Cu和不可避免的杂质，微维氏硬度为150或者 或均匀伸长率在5％以下，局部伸长率在10％以下，或含有0.05〜2质量％的Ni，0.001〜0.3质量％的P，0.005〜5质量％的Zn， Cu和不可避免的杂质作为其他组分，其微维氏硬度为150以上，均匀伸长率为5％以下，局部伸长率为10％以下。 在QFN封装切割过程中形成的引脚毛刺很短，用于切割QFN封装的切割刀片以较低的磨损率磨损。
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公开(公告)号：US06939621B2
公开(公告)日：2005-09-06
申请号：US10849155
申请日：2004-05-20
CPC分类号： C23C28/021 , C23C26/00 , C23C28/023 , C25D5/12 , H05K3/244 , Y10S428/929 , Y10S428/935 , Y10T428/12715 , Y10T428/12722 , Y10T428/1291
摘要： A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 μm. The copper-tin alloy layer has a thickness of 0.1-1.0 μm and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 μm for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 μm for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.
摘要翻译： 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。
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公开(公告)号：US06759142B2
公开(公告)日：2004-07-06
申请号：US10207027
申请日：2002-07-30
IPC分类号： B32B1520
CPC分类号： C23C28/021 , C23C26/00 , C23C28/023 , C25D5/12 , H05K3/244 , Y10S428/929 , Y10S428/935 , Y10T428/12715 , Y10T428/12722 , Y10T428/1291
摘要： A plated copper alloy material for connecting terminals is provided which comprises a parent material of copper or copper alloy, a nickel layer and a copper-tin alloy layer. The nickel layer has a thickness of 0.1-1.0 &mgr;m. The copper-tin alloy layer has a thickness of 0.1-1.0 &mgr;m and contains 35-75 at % of copper. The material may additionally have a tin layer no thicker than 0.5 &mgr;m for an engaging type terminal containing 0.001-0.1 mass % of carbon, or thicker than 0.5 &mgr;m for a non-engaging type connector. The material meets requirements for capability of insertion with a small force, good electric reliability (due to low contact resistance) in a high-temperature atmosphere, workability for sharp bending without cracking, good solder wettability and good corrosion resistance to sulfur dioxide gas.
摘要翻译： 提供一种用于连接端子的电镀铜合金材料，其包括铜或铜合金的母体材料，镍层和铜 - 锡合金层。 镍层的厚度为0.1-1.0μm。 铜 - 锡合金层的厚度为0.1-1.0μm，含有35-75at％的铜。 对于非接合型连接器，对于含有0.001-0.1质量％的碳或大于0.5μm的接合型端子，该材料可另外具有不超过0.5μm的锡层。 该材料在高温环境下能够以较小的力，良好的电气可靠性（由于接触电阻低）而满足对插入能力的要求，无裂纹的急剧弯曲的可加工性，良好的焊料润湿性和对二氧化硫气体的良好的耐腐蚀性。
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