The present invention relates to an aqueous epoxy resin composition which is able to contain a large amount of water because it uses an epoxy resin and a coagulant and thereby allows an emulsifier and water to be stably adsorbed and captured on tangled particle surfaces of the coagulant. The aqueous epoxy resin composition according to the present invention comprises a highly compatible formulation producing a good cross-linking bond in a curing reaction with a curing agent and hence it can effect functions including those of a coating agent, a primer agent, a mortar agent and an adhesive agent in a two-part formulation, and it entails a formulation using absolutely no volatile organic compounds in large amounts and hence it is environmentally-friendly and can also markedly reduce production costs.