发明授权
- 专利标题： Robust joint structure for flip-chip bonding
- 专利标题（中）： 坚固的接头结构，用于倒装芯片接合
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申请号： US12842304申请日： 2010-07-23
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公开(公告)号： US08847387B2公开(公告)日： 2014-09-30
- 发明人: Ching-Wen Hsiao , Yao-Chun Chuang , Chen-Shien Chen , Chen-Cheng Kuo , Ru-Ying Huang
- 申请人： Ching-Wen Hsiao , Yao-Chun Chuang , Chen-Shien Chen , Chen-Cheng Kuo , Ru-Ying Huang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/00 ; H01L23/498
摘要：
An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm.
公开/授权文献
- US20110101519A1 Robust Joint Structure for Flip-Chip Bonding 公开/授权日：2011-05-05