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公开(公告)号:US20110101519A1
公开(公告)日:2011-05-05
申请号:US12842304
申请日:2010-07-23
IPC分类号: H01L23/498
CPC分类号: H01L23/49827 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05022 , H01L2224/05073 , H01L2224/05075 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05571 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1146 , H01L2224/1147 , H01L2224/13022 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2924/00011 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/0105 , H01L2224/05552 , H01L2924/00 , H01L2224/81805
摘要: An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm.
摘要翻译: 集成电路结构包括第一工件和第二工件。 第一工件包括在第一工件的主表面处的铜凸块并且具有第一尺寸; 以及在铜凸块上并邻接铜凸点的含镍阻挡层。 第二工件被接合到第一工件并且在第二工件的主表面上包括接合焊盘; 以及在第二工件的主表面处的焊料掩模,并且具有暴露焊接焊盘的一部分的具有第二尺寸的阻焊剂开口。 第一尺寸与第二尺寸的比率大于约1.此外,焊料区域将铜凸块电连接到接合焊盘,接合焊盘和铜凸块之间的垂直距离大于约30μm。
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公开(公告)号:US08847387B2
公开(公告)日:2014-09-30
申请号:US12842304
申请日:2010-07-23
IPC分类号: H01L23/48 , H01L23/00 , H01L23/498
CPC分类号: H01L23/49827 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05022 , H01L2224/05073 , H01L2224/05075 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05571 , H01L2224/05572 , H01L2224/05582 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/1146 , H01L2224/1147 , H01L2224/13022 , H01L2224/13083 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/81193 , H01L2224/81203 , H01L2224/81815 , H01L2924/00011 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/0105 , H01L2224/05552 , H01L2924/00 , H01L2224/81805
摘要: An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm.
摘要翻译: 集成电路结构包括第一工件和第二工件。 第一工件包括在第一工件的主表面处的铜凸块并且具有第一尺寸; 以及在铜凸块上并邻接铜凸点的含镍阻挡层。 第二工件被接合到第一工件并且在第二工件的主表面上包括接合焊盘; 以及在第二工件的主表面处的焊料掩模,并且具有暴露焊接焊盘的一部分的具有第二尺寸的阻焊剂开口。 第一尺寸与第二尺寸的比率大于约1.此外,焊料区域将铜凸块电连接到接合焊盘,焊接块和铜凸块之间的垂直距离大于约30μm。
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公开(公告)号:US20110186986A1
公开(公告)日:2011-08-04
申请号:US12697008
申请日:2010-01-29
IPC分类号: H01L23/498 , H01L21/768 , H01L21/50
CPC分类号: H01L21/50 , H01L21/768 , H01L23/498 , H01L24/11 , H01L24/13 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/13017 , H01L2224/13019 , H01L2224/13076 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/16503 , H01L2224/32503 , H01L2224/32507 , H01L2224/81193 , H01L2224/8181 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要: A T-shaped post for semiconductor devices is provided. The T-shaped post has an under-bump metallization (UBM) section and a pillar section extending from the UBM section. The UBM section and the pillar section may be formed of a same material or different materials. In an embodiment, a substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like, having T-shaped posts is attached to a contact of another substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like. The T-shaped posts may have a solder material pre-formed on the pillar section such that the pillar section is exposed or such that the pillar section is covered by the solder material. In another embodiment, the T-shaped posts may be formed on one substrate and the solder material formed on the other substrate.
摘要翻译: 提供了一种用于半导体器件的T形柱。 T形柱具有凸起下金属化(UBM)部分和从UBM部分延伸的柱部分。 UBM部分和支柱部分可以由相同的材料或不同的材料形成。 在一个实施例中,具有T形柱的衬底(例如管芯,晶片,印刷电路板,封装衬底等)被附接到另一个衬底(例如管芯,晶片,印刷电路板, 包装衬底等。 T形柱可以具有预先形成在柱部上的焊料材料,使得柱部分暴露或者使得柱部分被焊料材料覆盖。 在另一个实施例中,T形柱可以形成在一个基底上,并且焊料材料形成在另一个基底上。
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公开(公告)号:US08299616B2
公开(公告)日:2012-10-30
申请号:US12697008
申请日:2010-01-29
CPC分类号: H01L21/50 , H01L21/768 , H01L23/498 , H01L24/11 , H01L24/13 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05166 , H01L2224/05184 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/05684 , H01L2224/13017 , H01L2224/13019 , H01L2224/13076 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/16503 , H01L2224/32503 , H01L2224/32507 , H01L2224/81193 , H01L2224/8181 , H01L2924/14 , H01L2924/15788 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2924/00014 , H01L2924/013
摘要: A T-shaped post for semiconductor devices is provided. The T-shaped post has an under-bump metallization (UBM) section and a pillar section extending from the UBM section. The UBM section and the pillar section may be formed of a same material or different materials. In an embodiment, a substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like, having T-shaped posts is attached to a contact of another substrate, such as a die, wafer, printed circuit board, packaging substrate, or the like. The T-shaped posts may have a solder material pre-formed on the pillar section such that the pillar section is exposed or such that the pillar section is covered by the solder material. In another embodiment, the T-shaped posts may be formed on one substrate and the solder material formed on the other substrate.
摘要翻译: 提供了一种用于半导体器件的T形柱。 T形柱具有凸起下金属化(UBM)部分和从UBM部分延伸的柱部分。 UBM部分和支柱部分可以由相同的材料或不同的材料形成。 在一个实施例中,具有T形柱的衬底(例如管芯,晶片,印刷电路板,封装衬底等)被附接到另一个衬底(例如管芯,晶片,印刷电路板, 包装衬底等。 T形柱可以具有预先形成在柱部上的焊料材料,使得柱部分暴露或者使得柱部分被焊料材料覆盖。 在另一个实施例中,T形柱可以形成在一个基底上,并且焊料材料形成在另一个基底上。
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5.
公开(公告)号:US20120270369A1
公开(公告)日:2012-10-25
申请号:US13540439
申请日:2012-07-02
IPC分类号: H01L21/60
CPC分类号: H01L23/49816 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/01027 , H01L2924/01083 , H01L2924/01015 , H01L2224/13099 , H01L2924/00
摘要: Methods for forming lead free solder interconnections for integrated circuits. A copper column extends from an input/output terminal of an integrated circuit. A cap layer of material is formed on the input/output terminal of the integrated circuit. A lead free solder connector is formed on the cap layer. A substrate having a metal finish solder pad is aligned with the solder connector. An intermetallic compound is formed at the interface between the cap layer and the lead free solder connector. A solder connection is formed between input/output terminal of the integrated circuit and the metal finish pad that is less than 0.5 weight percent copper, and the intermetallic compound is substantially free of copper.
摘要翻译: 用于形成用于集成电路的无铅焊料互连的方法。 铜列从集成电路的输入/输出端子延伸。 在集成电路的输入/输出端子上形成覆盖层材料。 在盖层上形成无铅焊料连接器。 具有金属整理剂焊盘的基板与焊料连接器对准。 在盖层和无铅焊料连接器之间的界面处形成金属间化合物。 在集成电路的输入/输出端子和小于0.5重量百分比的铜的金属表面焊盘之间形成焊料连接,并且金属间化合物基本上不含铜。
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公开(公告)号:US08232643B2
公开(公告)日:2012-07-31
申请号:US12729021
申请日:2010-03-22
IPC分类号: H01L23/488 , H01L21/60 , H01L23/31
CPC分类号: H01L23/49816 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/01027 , H01L2924/01083 , H01L2924/01015 , H01L2224/13099 , H01L2924/00
摘要: Lead free solder interconnections for integrated circuits. A copper column extends from an input/output terminal of an integrated circuit. A cap layer of material is formed on the input/output terminal of the integrated circuit. A lead free solder connector is formed on the cap layer. A substrate having a metal finish solder pad is aligned with the solder connector. An intermetallic compound is formed at the interface between the cap layer and the lead free solder connector. A solder connection is formed between the input/output terminal of the integrated circuit and the metal finish pad that is less than 0.5 weight percent copper, and the intermetallic compound is substantially free of copper.
摘要翻译: 集成电路的无铅焊接互连。 铜列从集成电路的输入/输出端子延伸。 在集成电路的输入/输出端子上形成覆盖层材料。 在盖层上形成无铅焊料连接器。 具有金属整理剂焊盘的基板与焊料连接器对准。 在盖层和无铅焊料连接器之间的界面处形成金属间化合物。 在集成电路的输入/输出端子和小于0.5重量百分比的铜的金属表面焊盘之间形成焊料连接,并且金属间化合物基本上不含铜。
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公开(公告)号:US20110193227A1
公开(公告)日:2011-08-11
申请号:US12729021
申请日:2010-03-22
IPC分类号: H01L23/488 , H01L21/60 , H01L23/31
CPC分类号: H01L23/49816 , H01L23/49811 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13164 , H01L2224/13169 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01043 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/01027 , H01L2924/01083 , H01L2924/01015 , H01L2224/13099 , H01L2924/00
摘要: Apparatus and methods for providing a robust solder connection in a flip chip arrangement using lead free solder are disclosed. A copper column extends from an input/output terminal of an integrated circuit. A cap layer of a material comprising one of nickel, nickel alloys, palladium, platinum, cobalt, silver, gold, and alloys of these is formed on the exterior surface of the copper column. A lead free solder connector is disposed on the cap layer. A substrate having a metal finish solder pad is aligned with the solder connector. A thermal reflow is performed. The metal finish may be of nickel, nickel alloy and nickel based materials. Following a thermal reflow, the solder connection formed between the copper terminal column and the metal finish solder pad is less than 0.5 wt. %.
摘要翻译: 公开了使用无铅焊料在倒装芯片布置中提供坚固的焊接连接的装置和方法。 铜列从集成电路的输入/输出端子延伸。 包含镍,镍合金,钯,铂,钴,银,金及其合金的材料的盖层形成在铜柱的外表面上。 无铅焊料连接器设置在盖层上。 具有金属整理剂焊盘的基板与焊料连接器对准。 进行热回流。 金属表面可以是镍,镍合金和镍基材料。 在热回流之后,形成在铜端子柱和金属表面焊料焊盘之间的焊接连接小于0.5wt。 %。
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公开(公告)号:US20110101526A1
公开(公告)日:2011-05-05
申请号:US12619468
申请日:2009-11-16
申请人: Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
发明人: Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
IPC分类号: H01L23/52 , H01L23/538
CPC分类号: H01L23/49816 , H01L23/49827 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/1146 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H05K3/3463 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要: An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The second work piece includes a bond pad. A solder is between and adjoining the first work piece and the second work piece, wherein the solder electrically connects the copper bump to the bond pad. The solder includes palladium.
摘要翻译: 集成电路结构包括第一工件和第二工件。 第一工件包括半导体衬底和半导体衬底上的铜凸块。 第二工件包括接合垫。 焊料在第一工件和第二工件之间并相邻,其中焊料将铜凸块电连接到接合焊盘。 焊料包括钯。
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公开(公告)号:US09607936B2
公开(公告)日:2017-03-28
申请号:US12619468
申请日:2009-11-16
申请人: Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
发明人: Ching-Wen Hsiao , Jiun Yi Wu , Ru-Ying Huang , Chen-Shien Chen
IPC分类号: H01L23/488 , H01L23/498 , H01L23/00 , H05K3/34
CPC分类号: H01L23/49816 , H01L23/49827 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/1146 , H01L2224/1147 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/13111 , H01L2224/13116 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/81191 , H01L2224/81193 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H05K3/3436 , H05K3/3463 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要: An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a semiconductor substrate, and a copper bump over the semiconductor substrate. The second work piece includes a bond pad. A solder is between and adjoining the first work piece and the second work piece, wherein the solder electrically connects the copper bump to the bond pad. The solder includes palladium.
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公开(公告)号:US09679836B2
公开(公告)日:2017-06-13
申请号:US13298102
申请日:2011-11-16
申请人: Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
发明人: Ching-Wen Hsiao , Ming-Da Cheng , Chih-Wei Lin , Chen-Shien Chen , Chih-Hua Chen , Chen-Cheng Kuo
IPC分类号: H01L23/48 , H01L23/498 , H01L21/683 , H01L25/10 , H01L23/31 , H01L23/00
CPC分类号: H01L23/49816 , H01L21/6835 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L25/105 , H01L2221/68318 , H01L2221/68345 , H01L2221/68381 , H01L2224/131 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/18161 , H01L2924/014 , H01L2924/00
摘要: A device includes a redistribution line, and a polymer region molded over the redistribution line. The polymer region includes a first flat top surface. A solder region is disposed in the polymer region and electrically coupled to the redistribution line. The solder region includes a second flat top surface not higher than the first flat top surface.
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