Invention Grant
- Patent Title: Method for aligning plate-like members and method for manufacturing electrical connecting apparatus
- Patent Title (中): 板状构件对齐方法及电连接装置的制造方法
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Application No.: US13720748Application Date: 2012-12-19
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Publication No.: US08851358B2Publication Date: 2014-10-07
- Inventor: Tomokazu Saito , Seito Moriyama
- Applicant: Kabushiki Kaisha Nihon Micronics
- Applicant Address: JP Musashino-shi, Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Musashino-shi, Tokyo
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Priority: JP2011-279736 20111221
- Main IPC: B23K31/02
- IPC: B23K31/02 ; H05K1/00 ; H05K1/03 ; H05K1/09 ; G01R1/073 ; G01R3/00

Abstract:
One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.
Public/Granted literature
- US20130161376A1 METHOD FOR ALIGNING PLATE-LIKE MEMBERS AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTING APPARATUS Public/Granted day:2013-06-27
Information query
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