Invention Grant
- Patent Title: Semiconductor device including trenches and method of manufacturing a semiconductor device
- Patent Title (中): 包括沟槽的半导体器件和制造半导体器件的方法
-
Application No.: US13690328Application Date: 2012-11-30
-
Publication No.: US08853774B2Publication Date: 2014-10-07
- Inventor: Maria Cotorogea , Hans Peter Felsl , Yvonne Gawlina , Francisco Javier Santos Rodriguez , Hans-Joachim Schulze , Georg Seibert , Andre Rainer Stegner , Wolfgang Wagner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L27/088

Abstract:
A semiconductor device includes a first transistor cell including a first gate electrode in a first trench. The semiconductor device further includes a second transistor cell including a second gate electrode in a second trench, wherein the first and second gate electrodes are electrically connected. The semiconductor device further includes a third trench between the first and second trenches, wherein the third trench extends deeper into a semiconductor body from a first side of the semiconductor body than the first and second trenches. The semiconductor device further includes a dielectric in the third trench covering a bottom side and walls of the third trench.
Public/Granted literature
- US20140151789A1 Semiconductor Device Including Trenches and Method of Manufacturing a Semiconductor Device Public/Granted day:2014-06-05
Information query
IPC分类: