Invention Grant
- Patent Title: Integrated circuit within semiconductor chip including cross-coupled transistor configuration
- Patent Title (中): 半导体芯片内的集成电路包括交叉耦合晶体管配置
-
Application No.: US14242308Application Date: 2014-04-01
-
Publication No.: US08853794B2Publication Date: 2014-10-07
- Inventor: Scott T. Becker , Jim Mali , Carole Lambert
- Applicant: Tela Innovations, Inc.
- Applicant Address: US CA Los Gatos
- Assignee: Tela Innovations, Inc.
- Current Assignee: Tela Innovations, Inc.
- Current Assignee Address: US CA Los Gatos
- Agency: Martine Penilla Group, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/092 ; G06F17/50

Abstract:
A first gate level feature forms gate electrodes of a first transistor of a first transistor type and a first transistor of a second transistor type. A second gate level feature forms a gate electrode of a second transistor of the first transistor type. A third gate level feature forms a gate electrode of a second transistor of the second transistor type. The gate electrodes of the second transistors of the first and second transistor types are positioned on opposite sides of a gate electrode track along which the gate electrodes of the first transistors of the first and second transistor types are positioned. The gate electrodes of the second transistors of the first and second transistor types are electrically connected to each other through an electrical connection that includes respective gate contacts and a conductive interconnect structure.
Public/Granted literature
- US20140210015A1 Integrated Circuit Within Semiconductor Chip Including Cross-Coupled Transistor Configuration Public/Granted day:2014-07-31
Information query
IPC分类: