发明授权
- 专利标题： Heat spreader structures in scribe lines
- 专利标题（中）： 散热器结构在划线
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申请号： US13023151申请日： 2011-02-08
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公开(公告)号： US08860208B2公开(公告)日： 2014-10-14
- 发明人: Hsien-Wei Chen , Yu-Wen Liu , Jyh-Cherng Sheu , Hao-Yi Tsai , Shin-Puu Jeng , Chen-Hua Yu , Shang-Yun Hou
- 申请人： Hsien-Wei Chen , Yu-Wen Liu , Jyh-Cherng Sheu , Hao-Yi Tsai , Shin-Puu Jeng , Chen-Hua Yu , Shang-Yun Hou
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/58 ; H01L21/78 ; H01L23/367 ; B23K26/36 ; B23K26/40 ; H01L21/66
摘要：
An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.
公开/授权文献
- US20110127648A1 Heat Spreader Structures in Scribe Lines 公开/授权日：2011-06-02
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