发明授权
- 专利标题: Molded heat spreaders
- 专利标题(中): 成型散热器
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申请号: US13836407申请日: 2013-03-15
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公开(公告)号: US08866290B2公开(公告)日: 2014-10-21
- 发明人: Zhizhong Tang , Syadwad Jain , Paul R. Start
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwabe, Williamson & Wyatt, P.C.
- 主分类号: H01L23/367
- IPC分类号: H01L23/367 ; B29C39/10 ; F28F3/00
摘要:
Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.
公开/授权文献
- US20140264821A1 MOLDED HEAT SPREADERS 公开/授权日:2014-09-18
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