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    Embedded bridge with through-silicon vias
    4.
    发明授权
    Embedded bridge with through-silicon vias 有权

    公开(公告)号：US10373893B2

    公开(公告)日：2019-08-06

    申请号：US15640406

    申请日：2017-06-30

    申请人： Intel Corporation

    发明人： Aditya S. Vaidya ,  Ravindranath V. Mahajan ,  Digvijay A. Raorane ,  Paul R. Start

    IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/00 ,  H01L25/16

    摘要： An integrated circuit (IC) package including a substrate comprising a dielectric, and at least one bridge die embedded in the first dielectric. The embedded bridge die comprises a plurality of through-vias extending from a first side to a second side and a first plurality of pads on the first side and a second plurality of pads on the second side. The first plurality of pads are interconnected to the second plurality of pads by the plurality of through-vias extending vertically through the bridge die. The second plurality of pads is coupled to a buried conductive layer in the substrate by solder joints or by an adhesive conductive film between the second plurality of pads of the bridge die and conductive structures in the buried conductive layer, and wherein the adhesive conductive film is over a second dielectric layer on the bridge die.

    Molded heat spreaders
    5.
    发明授权
    Molded heat spreaders 有权
    成型散热器

    公开(公告)号：US08866290B2

    公开(公告)日：2014-10-21

    申请号：US13836407

    申请日：2013-03-15

    申请人： Intel Corporation

    发明人： Zhizhong Tang ,  Syadwad Jain ,  Paul R. Start

    IPC分类号： H01L23/367 ,  B29C39/10 ,  F28F3/00

    CPC分类号： H01L23/367 ,  B29C39/10 ,  H01L21/4882 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/15311

    摘要： Embodiments of the present disclosure describe techniques and configurations for molded heat spreaders. In some embodiments, a heat spreader includes a first insert having a first face and a first side, the first face positioned to form a bottom surface of a first cavity, and a second insert having a second face and a second side, the second face positioned to form a bottom surface of a second cavity. The second cavity may have a depth that is different from a depth of the first cavity. The heat spreader may further include a molding material disposed between the first and second inserts and coupled with the first side and the second side, the molding material forming at least a portion of a side wall of the first cavity and at least a portion of a side wall of the second cavity. Other embodiments may be described and/or claimed.

    摘要翻译： 本公开的实施例描述了用于模制散热器的技术和配置。 在一些实施例中，散热器包括具有第一面和第一侧的第一插入件，第一面被定位成形成第一腔体的底面，第二插入件具有第二面和第二面，第二面 定位成形成第二腔的底表面。 第二腔可以具有与第一腔的深度不同的深度。 散热器还可以包括设置在第一和第二插入件之间并与第一侧和第二侧耦合的成型材料，模制材料形成第一空腔的侧壁的至少一部分和至少一部分 第二腔的侧壁。 可以描述和/或要求保护其他实施例。