Invention Grant
- Patent Title: Metal gate structure for semiconductor devices
- Patent Title (中): 半导体器件的金属栅极结构
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Application No.: US13781907Application Date: 2013-03-01
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Publication No.: US08872285B2Publication Date: 2014-10-28
- Inventor: Thilo Scheiper , Carsten Grass , Richard Carter , Martin Trentzsch
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/78

Abstract:
Disclosed herein are various embodiments of an improved metal gate structure for semiconductor devices, such as transistors. In one example disclosed herein, a transistor has a gate structure consisting of a gate insulation layer positioned on a semiconducting substrate, a high-k insulation layer positioned on the gate insulation layer, a layer of titanium nitride positioned on the high-k insulation layer, a layer of aluminum positioned on the layer of titanium nitride and a layer of polysilicon positioned on the layer of aluminum.
Public/Granted literature
- US20140246735A1 METAL GATE STRUCTURE FOR SEMICONDUCTOR DEVICES Public/Granted day:2014-09-04
Information query
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