An extended landing pad substrate package includes a dielectric layer having an upper surface and an opposite lower surface. A lower circuit pattern is embedded in the lower surface of the dielectric layer. The lower circuit pattern includes traces having a first thickness and extended landing pads having a second thickness greater than the first thickness. Blind via apertures are formed through an upper circuit pattern embedded into the upper surface of the dielectric layer, through the dielectric layer and to the extended landing pads. The length of the blind via apertures is minimized due to the increase second thickness of the extended landing pads as compared to the first thickness of traces. Accordingly, the width of the blind via apertures at the upper surface of the dielectric layer is minimized.