Invention Grant
- Patent Title: Wireless IC device component and wireless IC device
- Patent Title (中): 无线IC器件组件和无线IC器件
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Application No.: US14151852Application Date: 2014-01-10
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Publication No.: US08876010B2Publication Date: 2014-11-04
- Inventor: Noboru Kato , Yuya Dokai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd
- Current Assignee: Murata Manufacturing Co., Ltd
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-098437 20090414; JP2009-187318 20090812
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K19/077 ; H01Q1/22 ; H01Q7/00 ; H01Q9/26 ; H01Q9/28

Abstract:
A wireless IC device includes a wireless IC chip, a coupling electrode, and a radiation plate. The coupling electrode includes coupling portions arranged to be coupled to the wireless IC chip and a pair of opposing ends. The pair of opposing ends are capacitively coupled to each other and oppose the radiation plate to be coupled to the radiation plate. The wireless IC chip uses the radiation plate as an antenna to transmit and receive signals having certain frequencies to and from an RFID system.
Public/Granted literature
- US20140117099A1 WIRELESS IC DEVICE COMPONENT AND WIRELESS IC DEVICE Public/Granted day:2014-05-01
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