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公开(公告)号：US10673113B2
公开(公告)日：2020-06-02
申请号：US16379846
申请日：2019-04-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro Baba , Yuya Dokai
Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
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公开(公告)号：US10305531B2
公开(公告)日：2019-05-28
申请号：US15485490
申请日：2017-04-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromi Murayama , Yuya Dokai
IPC: H01Q1/40 , H04B1/40 , H01Q1/22 , H01Q7/00 , G06K19/077 , H04B1/3827 , H01Q1/24 , H01Q1/48
Abstract: A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.
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公开(公告)号：US09607258B2
公开(公告)日：2017-03-28
申请号：US14629536
申请日：2015-02-24
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromi Murayama , Yuya Dokai , Tsuyoshi Mukai , Kazuaki Higashibata , Masato Nomura , Noboru Kato
IPC: G06K19/06 , G06K19/077 , H01F38/14 , H01Q7/00 , H01Q1/22
CPC classification number: G06K19/07758 , G06K19/07722 , G06K19/07783 , G06K19/07784 , H01F38/14 , H01L2224/16225 , H01L2924/181 , H01Q1/2225 , H01Q1/2283 , H01Q7/00 , H01L2924/00012
Abstract: An antenna module includes an antenna element including coil patterns and via conductors coupling together two adjacent two coil patterns. At least one of the coil patterns has a spiral shape, is wound three or more turns parallel or substantially parallel to an outer edge of a principal surface of a multilayer body, includes a first partial pattern including an outer end portion, a second partial pattern extending parallel or substantially parallel with the first partial pattern and being adjacent to the first partial pattern with a first gap provided therebetween, and a third partial pattern extending parallel or substantially parallel with the second partial pattern and being adjacent to the second partial pattern with a second gap provided therebetween, the second gap being smaller than the first gap.
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公开(公告)号：US08944335B2
公开(公告)日：2015-02-03
申请号：US13738143
申请日：2013-01-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yuya Dokai , Masahiro Ozawa
CPC classification number: G06K19/0723 , H01L23/66 , H01L2223/6677 , H01L2924/0002 , H01L2924/15311 , H01L2924/19105 , H01Q1/2208 , H01Q1/38 , H01Q7/00 , H01Q21/30 , H05K1/182 , H01L2924/00
Abstract: A wireless IC device that improves radiation gain without increasing substrate size and easily adjusts impedance, includes a multilayer substrate including laminated base layers. On a side of an upper or first main surface of the multilayer substrate, a wireless IC element is arranged to process a high-frequency signal. On a side of a lower or second main surface of the multilayer substrate, a first radiator is provided and is coupled to the wireless IC element via a feeding circuit including first interlayer conductors. On the side of the first main surface, a second radiator is provided and is coupled to the first radiator via second interlayer conductors.
Abstract translation: 一种在不增加衬底尺寸并且容易调节阻抗的情况下提高辐射增益的无线IC器件包括包括层压基底层的多层衬底。 在多层基板的上部或第一主面的一侧，设置无线IC元件来处理高频信号。 在多层基板的下或第二主表面的一侧上，提供第一辐射器，并且经由包括第一层间导体的馈电电路耦合到无线IC元件。 在第一主表面的一侧，设置第二辐射器，并且经由第二层间导体与第一散热器耦合。
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公开(公告)号：US08917211B2
公开(公告)日：2014-12-23
申请号：US14182339
申请日：2014-02-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Yuya Dokai
CPC classification number: H01Q9/045 , G06K19/07749 , G06K19/0775 , H01L2224/16225 , H01L2224/16227 , H01Q1/2283 , H01Q1/36 , H01Q1/40 , H01Q7/00
Abstract: An antenna and a wireless IC device that includes the antenna are provided for which the manufacturing process is simple and for which there is a low probability of a poor connection occurring between a feeder portion and a radiation electrode. An antenna includes a radiation electrode that is provided on a main surface of an insulator board, a ground electrode and/or a counter electrode that is arranged so as to oppose the radiation electrode, and a magnetic field electrode that is connected to the radiation electrode through a connection portion. The magnetic field electrode is defined by line-shaped electrodes and feeds a signal to the radiation electrode from a feeder portion defined by ends of the line-shaped electrodes through the magnetic field electrode.
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Patent Agency Ranking
公开(公告)号：US10235544B2
公开(公告)日：2019-03-19
申请号：US14266973
申请日：2014-05-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tsuyoshi Mukai , Yuya Dokai
Abstract: An RFID tag inspection method includes the steps of transmitting a measurement signal from a reader/writer simultaneously to a plurality of RFID tags arrayed on a collective base member and configured to process radio signals, receiving response waves from the individual RFID tags in a batch by the reader/writer, and determining, based on strengths and a number of received signals read by the reader/writer, whether or not the individual RFID tags are acceptable. Thus, acceptance/rejection inspection can be performed on the plural RFID tags, which are arrayed on the collective base member, in a batch.
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公开(公告)号：US09634714B2
公开(公告)日：2017-04-25
申请号：US14560280
申请日：2014-12-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiromi Murayama , Yuya Dokai
IPC: H04B1/38 , H04B1/40 , H01Q1/22 , H01Q1/40 , H01Q7/00 , G06K19/077 , H04B1/3827 , H04B1/18
CPC classification number: H04B1/40 , G06K19/07749 , G06K19/07779 , G06K19/07786 , G06K19/07794 , H01Q1/2225 , H01Q1/242 , H01Q1/40 , H01Q1/48 , H01Q7/00 , H04B1/3827 , Y02D70/00
Abstract: A HF-band wireless communication device includes a wireless IC configured to process a radio signal, a first substrate including a first inductor pattern coupled to the wireless IC, and a second substrate which includes a coil-shaped second inductor pattern coupled in series to the first inductor pattern. An L value of the first inductor pattern is greater than an L value of the second inductor pattern, and the L value of the first inductor pattern is dominant in a resonant frequency of a resonance circuit including the first and second inductor patterns. A winding diameter of the second inductor pattern is greater than a winding diameter of the first inductor pattern, and the second inductor pattern defines a main radiating element.
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公开(公告)号：US09558440B2
公开(公告)日：2017-01-31
申请号：US14331337
申请日：2014-07-15
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo Ikemoto , Yuya Dokai , Noboru Kato
IPC: G06K19/077 , H04B5/00 , H01Q7/00 , G06K19/07 , H01Q1/22 , H01Q1/40 , H01Q9/16 , H01Q9/20 , G06K19/073
CPC classification number: G06K19/0723 , G06K19/073 , G06K19/07749 , G06K19/07756 , H01L2224/16225 , H01L2224/73204 , H01Q1/2225 , H01Q1/40 , H01Q7/00 , H01Q9/16 , H01Q9/20 , H04B5/0012
Abstract: An electromagnetic coupling module includes a wireless IC chip and a functional substrate. The electromagnetic coupling module is mounted on a radiation plate, preferably using an adhesive, for example. On the upper surface of a base material of the radiation plate, two long radiation electrodes are provided. On the undersurface of the functional substrate, capacitive coupling electrodes that individually face inner ends of the radiation electrodes are provided. A matching circuit arranged to perform the impedance matching between the wireless IC chip and each of the radiation electrodes includes the capacitive coupling electrodes. As a result, it is possible to reduce the size, facilitate the design, and reduce the cost of a wireless IC device.
Abstract translation: 电磁耦合模块包括无线IC芯片和功能基板。 电磁耦合模块例如安装在辐射板上，优选使用粘合剂。 在辐射板的基材的上表面上设置两个长的辐射电极。 在功能基板的下表面上，设置分别面对辐射电极内端的电容耦合电极。 布置成执行无线IC芯片和每个辐射电极之间的阻抗匹配的匹配电路包括电容耦合电极。 结果，可以减小无线IC器件的尺寸，便于设计和降低成本。
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公开(公告)号：US10305156B2
公开(公告)日：2019-05-28
申请号：US15456694
申请日：2017-03-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro Baba , Yuya Dokai
Abstract: In a transmission line, a first ground conductor pattern and a second ground conductor pattern are connected through a first interlayer connecting conductor, and the first ground conductor pattern and a third ground conductor pattern are connected through a second interlayer connecting conductor. A first signal conductor pattern includes a first bypassing pattern portion that bypasses the first interlayer connecting conductor, and a second signal conductor pattern includes a second bypassing pattern portion that bypasses the second interlayer connecting conductor. Bypassing directions of the first bypassing pattern portion and the second bypassing pattern portion are opposite to each other.
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公开(公告)号：US09830552B2
公开(公告)日：2017-11-28
申请号：US13964234
申请日：2013-08-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Satoshi Ishino , Takeshi Kataya , Ikuhei Kimura , Nobuo Ikemoto , Yuya Dokai
IPC: H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , G06K19/077 , H05K1/14 , G06K19/06 , G06K19/07 , H05K1/02 , H05K1/16
CPC classification number: G06K19/07749 , G06K19/06187 , G06K19/0723 , G06K19/07756 , G06K19/07773 , G06K19/07779 , G06K19/07783 , G06K19/07784 , G06K19/07786 , H01L23/49838 , H01L23/552 , H01L23/66 , H01L2223/6655 , H01L2223/6677 , H01L2224/16227 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01Q1/36 , H01Q1/38 , H01Q1/42 , H01Q1/44 , H01Q7/00 , H01Q9/16 , H01Q9/30 , H01Q13/10 , H05K1/0216 , H05K1/0237 , H05K1/0239 , H05K1/141 , H05K1/16 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10098 , H05K2201/10371 , H05K2201/10522 , H01L2924/00014 , H01L2924/00
Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
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