Invention Grant
- Patent Title: Microneedle and method of manufacturing microneedle
- Patent Title (中): 微针和制造微针的方法
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Application No.: US13649687Application Date: 2012-10-11
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Publication No.: US08876575B2Publication Date: 2014-11-04
- Inventor: Hiroshi Sugimura , Gaku Suzuki , Masahiro Ueno , Yoshihiro Kodama , Takao Tomono
- Applicant: Toppan Printing Co., Ltd.
- Applicant Address: JP Tokyo JP Tosu
- Assignee: Toppan Printing Co., Ltd.,Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee: Toppan Printing Co., Ltd.,Hisamitsu Pharmaceutical Co., Inc.
- Current Assignee Address: JP Tokyo JP Tosu
- Agency: Staas & Halsey LLP
- Priority: JP2006-204417 20060727; JP2006-308877 20061115
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B19/16 ; B29C33/42 ; B29C33/38 ; A61M37/00 ; B29L31/00

Abstract:
A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves.
Public/Granted literature
- US20130030374A1 MICRONEEDLE AND METHOD OF MANUFACTURING MICRONEEDLE Public/Granted day:2013-01-31
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