发明授权
US08877299B2 Method for enhancing a substrate using gas cluster ion beam processing
有权
使用气体团簇离子束加工增强基体的方法
- 专利标题: Method for enhancing a substrate using gas cluster ion beam processing
- 专利标题(中): 使用气体团簇离子束加工增强基体的方法
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申请号: US12415867申请日: 2009-03-31
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公开(公告)号: US08877299B2公开(公告)日: 2014-11-04
- 发明人: John J. Hautala , Nathan E. Baxter , Koji Yamashita
- 申请人: John J. Hautala , Nathan E. Baxter , Koji Yamashita
- 申请人地址: US MA Billerica
- 专利权人: TEL Epion Inc.
- 当前专利权人: TEL Epion Inc.
- 当前专利权人地址: US MA Billerica
- 代理机构: Wood, Herron & Evans, LLP
- 主分类号: C23C14/02
- IPC分类号: C23C14/02 ; H05H1/24 ; H01L21/263 ; H01J37/08 ; H01J37/317
摘要:
A method of enhancing a material layer on a substrate is described. The method comprises establishing a gas cluster ion beam (GCIB), and treating a host region of the substrate by exposing the host region of the substrate to the GCIB. The treatment with the GCIB may selectively remove an undesirable specie and/or introduce a desirable specie to the host region.
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