Invention Grant
- Patent Title: Flip-chip semiconductor chip packing method
- Patent Title (中): 倒装芯片半导体芯片封装方法
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Application No.: US13678847Application Date: 2012-11-16
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Publication No.: US08877555B2Publication Date: 2014-11-04
- Inventor: Lei Shi , Yan Xun Xue , Yuping Gong
- Applicant: Lei Shi , Yan Xun Xue , Yuping Gong
- Applicant Address: US CA Sunnyvale
- Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee: Alpha & Omega Semiconductor, Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: CHEmily LLC
- Agent Chein-Hwa Tsao
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/00
Abstract:
Preparation methods of forming packaged semiconductor device, specifically for flip-chip vertical power device, are disclosed. In these methods, a vertical semiconductor chip is flip-chip attached to a lead frame and then encapsulated with plastic packing materials. Encapsulated chip is then thinned to a predetermined thickness. Contact terminals connecting the chip with external circuit are formed by etching at least a bottom portion of the lead frame connected.
Public/Granted literature
- US20140141567A1 Flip-chip Semiconductor Chip Packing Method Public/Granted day:2014-05-22
Information query
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