Invention Grant
- Patent Title: Molded SiP package with reinforced solder columns
- Patent Title (中): 带增强焊料柱的成型SiP封装
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Application No.: US11414526Application Date: 2006-04-28
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Publication No.: US08878346B2Publication Date: 2014-11-04
- Inventor: Chin-Tien Chiu , Hem Takiar , Hui Liu , Jiang Hua Java Zhu , Jack Chang-Chien , Cheemen Yu
- Applicant: Chin-Tien Chiu , Hem Takiar , Hui Liu , Jiang Hua Java Zhu , Jack Chang-Chien , Cheemen Yu
- Applicant Address: US TX Plano
- Assignee: SanDisk Technologies Inc.
- Current Assignee: SanDisk Technologies Inc.
- Current Assignee Address: US TX Plano
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H05K3/30 ; H05K3/34 ; H01L23/00
Abstract:
An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.
Public/Granted literature
- US20070252254A1 Molded SiP package with reinforced solder columns Public/Granted day:2007-11-01
Information query
IPC分类:
