Invention Grant
- Patent Title: Haptic feedback apparatus
- Patent Title (中): 触觉反馈装置
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Application No.: US13438356Application Date: 2012-04-03
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Publication No.: US08878420B2Publication Date: 2014-11-04
- Inventor: Lin Liu , Jie He
- Applicant: Lin Liu , Jie He
- Applicant Address: CN Shenzhen US CA La Verne
- Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee Address: CN Shenzhen US CA La Verne
- Agency: Anova Law Group, PLLC
- Priority: CN201120096871U 20110404
- Main IPC: H01L41/08
- IPC: H01L41/08 ; G06F3/01 ; H01L41/09

Abstract:
Disclosed is an apparatus used in an electronic device for providing haptic feedback. The apparatus includes a main board defining a mounting surface, a vibration unit mounted on the mounting surface of the main board, the vibration unit being capable of vibrating along a direction parallel to the mounting surface. At least two screws are provided to fix the vibration unit on the main board, and a pair of stop block is provided to restricting the position of the vibration unit.
Public/Granted literature
- US20120248935A1 HAPTIC FEEDBACK APPARATUS Public/Granted day:2012-10-04
Information query
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