发明授权
US08884357B2 Vertical NAND and method of making thereof using sequential stack etching and landing pad 有权
垂直NAND及其使用顺序堆栈蚀刻和着陆焊盘的方法

Vertical NAND and method of making thereof using sequential stack etching and landing pad
摘要:
A vertical NAND string device includes a semiconductor channel, where at least one end portion of the semiconductor channel extends substantially perpendicular to a major surface of a substrate, at least one semiconductor or electrically conductive landing pad embedded in the semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, a blocking dielectric located adjacent to the charge storage region and a plurality of control gate electrodes extending substantially parallel to the major surface of the substrate.
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