发明授权
US08884357B2 Vertical NAND and method of making thereof using sequential stack etching and landing pad
有权
垂直NAND及其使用顺序堆栈蚀刻和着陆焊盘的方法
- 专利标题: Vertical NAND and method of making thereof using sequential stack etching and landing pad
- 专利标题(中): 垂直NAND及其使用顺序堆栈蚀刻和着陆焊盘的方法
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申请号: US14219161申请日: 2014-03-19
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公开(公告)号: US08884357B2公开(公告)日: 2014-11-11
- 发明人: Chi-Ming Wang , Johann Alsmeier , Henry Chien , Xiying Costa , Yung-Tin Chen , Christopher Petti
- 申请人: SanDisk Technologies, Inc.
- 申请人地址: US TX Plano
- 专利权人: Sandisk Technologies Inc.
- 当前专利权人: Sandisk Technologies Inc.
- 当前专利权人地址: US TX Plano
- 代理机构: The Marbury Law Group PLLC
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/78 ; H01L27/115
摘要:
A vertical NAND string device includes a semiconductor channel, where at least one end portion of the semiconductor channel extends substantially perpendicular to a major surface of a substrate, at least one semiconductor or electrically conductive landing pad embedded in the semiconductor channel, a tunnel dielectric located adjacent to the semiconductor channel, a charge storage region located adjacent to the tunnel dielectric, a blocking dielectric located adjacent to the charge storage region and a plurality of control gate electrodes extending substantially parallel to the major surface of the substrate.
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