A microelectronic assembly includes a dielectric element, first and second microelectronic elements, signal leads, and one or more jumper leads. The dielectric element has oppositely-facing first and second surfaces and first and second apertures extend between the surfaces. A plurality of electrically conductive elements are positioned thereon. Signal leads are connected to one or more of the microelectronic elements and extend through one or more of the first or second apertures to some of the conductive elements on the dielectric element. One or more jumper leads extend through the first aperture and are connected to a contact of the first microelectronic element. The one or more jumper leads span over the second aperture and are connected to a conductive element on the dielectric element.