Invention Grant
- Patent Title: Heat removal in compact computing systems
- Patent Title (中): 紧凑型计算系统中的散热
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Application No.: US13633823Application Date: 2012-10-02
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Publication No.: US08897016B2Publication Date: 2014-11-25
- Inventor: Brett W. Degner , Peteris K. Augenbergs , Frank Liang , Amaury J. Heresztyn , Dinesh Mathew , Thomas W. Wilson
- Applicant: Apple Inc.
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K5/00 ; H01L23/10 ; G06F1/20 ; F28F7/00 ; F28F1/00 ; H01L23/40 ; B23P15/26 ; H01L23/427
Abstract:
A low profile heat removal system suitable for removing excess heat generated by a component operating in a compact computing environment is disclosed.
Public/Granted literature
- US20130094141A1 HEAT REMOVAL IN COMPACT COMPUTING SYSTEMS Public/Granted day:2013-04-18
Information query
