Invention Grant
- Patent Title: Wafer processing based on sensor detection and system learning
- Patent Title (中): 基于传感器检测和系统学习的晶片处理
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Application No.: US13236818Application Date: 2011-09-20
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Publication No.: US08897906B2Publication Date: 2014-11-25
- Inventor: Tomohiro Ohashi , Akitaka Makino , Hiroho Kitada , Hideki Kihara
- Applicant: Tomohiro Ohashi , Akitaka Makino , Hiroho Kitada , Hideki Kihara
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2011-181113 20110823
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/677
Abstract:
A vacuum processing apparatus includes a robot connected to a vacuum container to carry a wafer on one of its two arms to or from a processing chamber; a unit to detect an amount of deviation of the wafer from a predetermined wafer mounting position on the arm that may occur when the robot carries the wafer into or out of the processing chamber; and an adjusting device to adjust the operation of the robot based on the detected amount of deviation. The adjusting device adjusts the robot operation based on the result of a teaching operation performed in advance. After being subjected to the initial teaching operation, the robot again undergoes a second teaching operation according to the information on the amount of wafer position deviation that is detected by moving the wafer in a predetermined transfer pattern, before the wafer processing is performed.
Public/Granted literature
- US20130053997A1 VACUUM PROCESSING APPARATUS AND VACUUM PROCESSING METHOD Public/Granted day:2013-02-28
Information query
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