Invention Grant
- Patent Title: Thermal protection structure for multi-junction LED module
- Patent Title (中): 多结LED模块的热保护结构
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Application No.: US13287171Application Date: 2011-11-02
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Publication No.: US08899787B2Publication Date: 2014-12-02
- Inventor: Wei-Yu Yeh
- Applicant: Wei-Yu Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee: TSMC Solid State Lighting Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: F21V27/00
- IPC: F21V27/00 ; H05B33/08

Abstract:
The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
Public/Granted literature
- US20130106297A1 THERMAL PROTECTION STRUCTURE FOR MULTI-JUNCTION LED MODULE Public/Granted day:2013-05-02
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