-
1.发明授权Lighting apparatus having improved light output uniformity and thermal dissipation 有权具有改善的光输出均匀性和散热的照明装置公开(公告)号：US08939611B2
公开(公告)日：2015-01-27
申请号：US13293272
申请日：2011-11-10
Applicant: Pei-Wen Ko , Wei-Yu Yeh
Inventor： Pei-Wen Ko , Wei-Yu Yeh
IPC: F21V29/00 , F21V13/02 , F21S6/00 , F21V17/12 , F21Y101/02
CPC classification number: F21K9/54 , F21K9/62 , F21S6/00 , F21V13/02 , F21V17/12 , F21V29/50 , F21V29/70 , F21V29/763 , F21Y2115/10
Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.
Abstract translation: 本公开涉及一种照明装置。 照明装置包括产生光的光子器件。 照明装置包括其上设置有光子装置的印刷电路板（PCB）。 照明装置包括具有覆盖PCB和光子装置的弯曲轮廓的扩散器盖。 扩散器盖具有纹理表面，用于散射由光子器件产生的光。 照明装置包括导热杯，该导热杯围绕扩散器盖并与PCB导热耦合。 杯子具有反射透射通过扩散器盖的光的反射内表面。 照明装置包括用于散发由光子器件产生的热的散热结构。 散热结构热耦合到杯子。
-
公开(公告)号：US20130148346A1
公开(公告)日：2013-06-13
申请号：US13313153
申请日：2011-12-07
Applicant: Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
Inventor： Chih-Hsuan Sun , Wei-Yu Yeh , Hsueh-Hung Fu , Dong Jung Suen
CPC classification number: F21K9/60 , B05D5/061 , B05D5/063 , F21K9/20 , F21K9/232 , F21K9/66 , F21V3/049 , F21V3/0625 , F21V3/10 , F21V7/0016 , F21V29/74 , F21V29/773 , F21Y2101/00 , F21Y2115/10
Abstract: The present disclosure provides an illumination device. The illumination device includes a cap structure. The cap structure is partially coated with a reflective material operable to reflect light. The illumination device includes one or more lighting-emitting devices disposed within the cap structure. The light-emitting devices may be light-emitting diode (LED) chips. The illumination device also includes a thermal dissipation structure. The thermal dissipation structure is coupled to the cap structure in a first direction. The thermal dissipation structure and the cap structure have a coupling interface. The coupling interface extends in a second direction substantially perpendicular to the first direction. The thermal dissipation structure has a portion that intersects the coupling interface at an angle. The angle is in a range from about 60 degrees to about 90 degrees according to some embodiments.
Abstract translation: 本公开提供一种照明装置。 照明装置包括盖结构。 盖结构部分地涂覆有可反射光的反射材料。 照明装置包括设置在盖结构内的一个或多个发光装置。 发光装置可以是发光二极管（LED）芯片。 照明装置还包括散热结构。 散热结构在第一方向上连接到盖结构。 散热结构和盖结构具有耦合接口。 联接接口在基本上垂直于第一方向的第二方向上延伸。 散热结构具有以一定角度与耦合接口相交的部分。 根据一些实施例，该角度在约60度至约90度的范围内。
-
公开(公告)号：US20130120982A1
公开(公告)日：2013-05-16
申请号：US13293272
申请日：2011-11-10
Applicant: Pei-Wen Ko , Wei-Yu Yeh
Inventor： Pei-Wen Ko , Wei-Yu Yeh
CPC classification number: F21K9/54 , F21K9/62 , F21S6/00 , F21V13/02 , F21V17/12 , F21V29/50 , F21V29/70 , F21V29/763 , F21Y2115/10
Abstract: The present disclosure involves a lighting apparatus. The lighting apparatus includes a photonic device that generates light. The lighting apparatus includes a printed circuit board (PCB) on which the photonic device is located. The lighting apparatus includes a diffuser cap having a curved profile covering the PCB and the photonic device. The diffuser cap has a textured surface for scattering light generated by the photonic device. The lighting apparatus includes a thermally conductive cup that surrounds the diffuser cap and thermal conductively coupled to the PCB. The cup has a reflective inner surface that reflects light transmitting through the diffuser cap. The lighting apparatus includes a heat dissipation structure for dissipating heat generated by the photonic device. The heat dissipation structure is thermally coupled to the cup.
-
公开(公告)号：US20120299019A1
公开(公告)日：2012-11-29
申请号：US13117320
申请日：2011-05-27
Applicant: Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
Inventor： Tien-Ming Lin , Chih-Hsuan Sun , Wei-Yu Yeh
CPC classification number: H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/0002 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014 , H01L2924/00
Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.
Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。
-
5.发明申请Light Emitting Diode Light Bar Module with Electrical Connectors Formed by Injection Molding 有权具有通过注塑成型的电连接器的发光二极管灯条模块公开(公告)号：US20120287635A1
公开(公告)日：2012-11-15
申请号：US13557315
申请日：2012-07-25
Applicant: Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
Inventor： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
CPC classification number: B29C45/0001 , B29C45/14262 , B29C45/14311 , B29C45/14639 , B29K2705/02 , F21S4/20 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R43/24 , Y10T29/53
Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。
-
Patent Agency Ranking
公开(公告)号：US08757845B2
公开(公告)日：2014-06-24
申请号：US13194538
申请日：2011-07-29
Applicant: Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
Inventor： Chi Xiang Tseng , Hsiao-Wen Lee , Sheng-Shin Guo , Pei-Wen Ko , Chih-Hsuan Sun , Wei-Yu Yeh
IPC: F21V7/07
CPC classification number: F21K9/50 , F21K9/60 , F21K9/90 , F21V3/02 , F21V3/0625 , F21V5/008 , F21V5/04 , F21V7/0091 , F21V29/77 , F21V29/89 , F21Y2115/10 , H01L33/58 , H01L2933/0091 , Y10T29/49826
Abstract: The present disclosure provides one embodiment of an illumination structure. The illumination structure includes a light-emitting diode (LED) device on a substrate; a lens secured on the substrate and over the LED device; and a diffuser cap secured on the substrate and covering the lens, wherein the lens and diffuser cap are designed and configured to redistribute emitting light from the LED device for wide angle illumination.
Abstract translation: 本公开提供了照明结构的一个实施例。 照明结构包括在基板上的发光二极管（LED）装置; 固定在基板上并在LED器件上方的透镜; 以及固定在所述基板上并覆盖所述透镜的散射器盖，其中所述透镜和扩散器盖被设计和配置为重新分配来自所述LED装置的光以用于广角照明。
-
公开(公告)号：US20130201669A1
公开(公告)日：2013-08-08
申请号：US13366063
申请日：2012-02-03
Applicant: Wei-Yu Yeh , Pei-Wen Ko
Inventor： Wei-Yu Yeh , Pei-Wen Ko
CPC classification number: F21V3/00 , F21Y2105/10 , F21Y2105/12 , F21Y2107/50 , F21Y2115/10
Abstract: The present disclosure involves an LED illumination apparatus. The illumination apparatus includes a substrate and a plurality of LED modules disposed over the substrate according to a predefined layout pattern. The layout pattern includes a row having a vertically-aligned LED module located laterally adjacent to a first horizontally-aligned LED module and a second horizontally-aligned LED module. The layout pattern also includes a column having a horizontally-aligned LED module located laterally adjacent to a first vertically-aligned LED module and a second vertically-aligned LED module. The layout pattern further includes a row of horizontally-aligned LED modules located laterally adjacent to one another. The illumination apparatus also includes a diffuser disposed over the plurality of LED modules. Each LED module also includes a secondary optical component providing an asymmetric light pattern. The plurality of LED modules provides a linear light distribution or a planar light distribution on the diffuser.
Abstract translation: 本公开涉及一种LED照明装置。 照明装置包括基板和根据预定布局图案设置在基板上的多个LED模块。 布局图案包括具有横向相邻于第一水平对准LED模块和第二水平对准LED模块的垂直对齐的LED模块的行。 布局图案还包括具有横向相邻于第一垂直对齐的LED模块和第二垂直对齐的LED模块的水平对齐的LED模块的列。 布局图案还包括一排水平对准的LED模块，其横向相邻地定位。 照明装置还包括设置在多个LED模块上的扩散器。 每个LED模块还包括提供非对称光图案的次级光学部件。 多个LED模块在扩散器上提供线性光分布或平面光分布。
-
公开(公告)号：US20130106297A1
公开(公告)日：2013-05-02
申请号：US13287171
申请日：2011-11-02
Applicant: Wei-Yu Yeh
Inventor： Wei-Yu Yeh
IPC: H05B37/02
CPC classification number: H05B33/089 , H05B33/0851 , Y02B20/341
Abstract: The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
Abstract translation: 本公开公开了一种用于热保护LED装置的装置。 该装置包括基板。 该装置包括设置在基板上的多个发光装置。 所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。 该装置包括电耦合到所选择的发光装置的反馈机构。 反馈机构可操作以检测所选择的发光装置的温度变化。 反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。
-
9.发明申请LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权带注射成型电气连接器的发光二极管灯模块公开(公告)号：US20120088397A1
公开(公告)日：2012-04-12
申请号：US12899999
申请日：2010-10-07
Applicant: Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
Inventor： Hsiao-Wen Lee , Chih-Hsuan Sun , Wei-Yu Yeh
CPC classification number: B29C45/0001 , B29C45/14262 , B29C45/14311 , B29C45/14639 , B29K2705/02 , F21S4/20 , F21V23/06 , F21Y2103/10 , F21Y2115/10 , H01R43/24 , Y10T29/53
Abstract: The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.
Abstract translation: 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。
-
公开(公告)号：US08899787B2
公开(公告)日：2014-12-02
申请号：US13287171
申请日：2011-11-02
Applicant: Wei-Yu Yeh
Inventor： Wei-Yu Yeh
CPC classification number: H05B33/089 , H05B33/0851 , Y02B20/341
Abstract: The present disclosure discloses an apparatus for thermally protecting an LED device. The apparatus includes a substrate. The apparatus includes a plurality of light-emitting devices disposed over the substrate. A selected one of the plurality of light-emitting devices is at least partially surrounded by the rest of the plurality of light-emitting devices. The apparatus includes a feedback mechanism electrically coupled to the selected light-emitting device. The feedback mechanism is operable to detect a change in a temperature of the selected light-emitting device. The feedback mechanism is also operable to adjust an electrical current through at least the selected light-emitting device in response to the detected change in the temperature.
Abstract translation: 本公开公开了一种用于热保护LED装置的装置。 该装置包括基板。 该装置包括设置在基板上的多个发光装置。 所述多个发光器件中的所选择的一个至少部分地被所述多个发光器件的其余部分包围。 该装置包括电耦合到所选择的发光装置的反馈机构。 反馈机构可操作以检测所选择的发光装置的温度变化。 反馈机构还可操作以响应于检测到的温度变化而调节通过至少所选择的发光器件的电流。
-
-
-
-
-
-
-
-
-
Search Results
33
records
(took 0.016 seconds)
