发明授权
- 专利标题： Texturing and cleaning agent for the surface treatment of wafers and use thereof
- 专利标题（中）： 用于表面处理晶片的纹理和清洁剂及其用途
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申请号： US12792284申请日： 2010-06-02
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公开(公告)号： US08900472B2公开(公告)日： 2014-12-02
- 发明人: Kuno Mayer , Mark Schumann , Daniel Kray , Teresa Orellana Peres , Jochen Rentsch , Martin Zimmer , Elias Kirchgässner , Eva Zimmer , Daniel Biro , Arpad Mihai Rostas , Filip Granek
- 申请人： Kuno Mayer , Mark Schumann , Daniel Kray , Teresa Orellana Peres , Jochen Rentsch , Martin Zimmer , Elias Kirchgässner , Eva Zimmer , Daniel Biro , Arpad Mihai Rostas , Filip Granek
- 申请人地址： DE München
- 专利权人： Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung E.V.
- 当前专利权人： Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung E.V.
- 当前专利权人地址： DE München
- 代理机构： Gibson & Dernier LLP
- 代理商 Timothy X. Gibson, Esq.
- 优先权： DE102007058829 20071206
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; C09K13/02 ; C11D11/00 ; C11D7/06 ; C11D7/26 ; C11D7/32
摘要：
A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.
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