Invention Grant
- Patent Title: Rapid thermal processing chamber with micro-positioning system
- Patent Title (中): 具有微型定位系统的快速热处理室
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Application No.: US13656150Application Date: 2012-10-19
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Publication No.: US08900889B2Publication Date: 2014-12-02
- Inventor: Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/687 ; H01L21/67 ; H01L21/68
Abstract:
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
Public/Granted literature
- US20130043632A1 RAPID THERMAL PROCESSING CHAMBER WITH MICRO-POSITIONING SYSTEM Public/Granted day:2013-02-21
Information query
IPC分类:
