公开(公告)号：US09552989B2

公开(公告)日：2017-01-24

申请号：US14012473

申请日：2013-08-28

Applicant: Applied Materials, Inc.

Inventor： Blake R. Koelmel ,  Norman L. Tam ,  Joseph M. Ranish

IPC: F21V9/00 ,  F26B19/00 ,  H01L21/263 ,  H01L21/67

CPC classification number: H01L21/2636 ,  H01L21/67098 ,  H01L21/67115

Abstract: Methods and apparatus for processing substrates and controlling the heating and cooling of substrates are described. A radiation source providing radiation in a first range of wavelengths heats the substrate within a predetermined temperature range, the substrate being absorptive of radiation in a second range of wavelengths within the first range of wavelengths and within the predetermined temperature rang. A filter prevents at least a portion of radiation within the second wavelength range from reaching the substrate.

Abstract translation: 描述了用于处理衬底和控制衬底的加热和冷却的方法和设备。 提供在第一波长范围内的辐射的辐射源将衬底加热到​​预定温度范围内，所述衬底吸收第一波长范围内的第二波长范围内且在预定温度范围内的辐射。 滤光器防止第二波长范围内的至少一部分辐射到达基板。

公开(公告)号：US09564349B2

公开(公告)日：2017-02-07

申请号：US13656158

申请日：2012-10-19

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/68 ,  H01L21/687 ,  C23C16/46 ,  H01L21/683

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US20150050118A1

公开(公告)日：2015-02-19

申请号：US14529848

申请日：2014-10-31

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/324 ,  H01L21/68

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US09390950B2

公开(公告)日：2016-07-12

申请号：US14529848

申请日：2014-10-31

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/687 ,  H01L21/324

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

公开(公告)号：US08900889B2

公开(公告)日：2014-12-02

申请号：US13656150

申请日：2012-10-19

Applicant: Applied Materials, Inc.

Inventor： Khurshed Sorabji ,  Joseph M. Ranish ,  Wolfgang Aderhold ,  Aaron M. Hunter ,  Blake R. Koelmel ,  Alexander N. Lerner ,  Nir Merry

IPC: H01L21/66 ,  H01L21/687 ,  H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67259 ,  C23C16/46 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6835 ,  H01L21/68742

Abstract: Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Abstract translation: 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。