Invention Grant
- Patent Title: Semiconductor device and structure for heat removal
- Patent Title (中): 半导体器件和结构的散热
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Application No.: US13041405Application Date: 2011-03-06
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Publication No.: US08901613B2Publication Date: 2014-12-02
- Inventor: Deepak C. Sekar , Zvi Or-Bach , Brian Cronquist
- Applicant: Deepak C. Sekar , Zvi Or-Bach , Brian Cronquist
- Applicant Address: US CA San Jose
- Assignee: Monolithic 3D Inc.
- Current Assignee: Monolithic 3D Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H01L23/367
Abstract:
A semiconductor device comprising power distribution wires wherein; a portion of said wires have thermal connection to the semiconductor layer and said thermal connection designed to conduct heat but to not conduct electricity.
Public/Granted literature
- US20120223436A1 SEMICONDUCTOR DEVICE AND STRUCTURE FOR HEAT REMOVAL Public/Granted day:2012-09-06
Information query
IPC分类:
