发明授权
US08901724B2 Semiconductor package with embedded die and its methods of fabrication
有权
具有嵌入式芯片的半导体封装及其制造方法
- 专利标题： Semiconductor package with embedded die and its methods of fabrication
- 专利标题（中）： 具有嵌入式芯片的半导体封装及其制造方法
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申请号： US12655335申请日： 2009-12-29
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公开(公告)号： US08901724B2公开(公告)日： 2014-12-02
- 发明人: John Stephen Guzek , Javier Soto Gonzalez , Nicholas R. Watts , Ravi K. Nalla
- 申请人： John Stephen Guzek , Javier Soto Gonzalez , Nicholas R. Watts , Ravi K. Nalla
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Winkle, PLLC
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/12 ; H01L23/053 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L21/56 ; H01L25/03 ; H01L21/683 ; H01L23/538 ; H05K1/18 ; H01L25/10 ; H05K3/46 ; H01L23/00
摘要：
Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
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