Invention Grant
- Patent Title: Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same
- Patent Title (中): 具有用于散热的封装层外侧的侧翼部分的电子封装结构及其制造方法
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Application No.: US13175362Application Date: 2011-07-01
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Publication No.: US08906741B2Publication Date: 2014-12-09
- Inventor: Bau-Ru Lu , Kai-Peng Chiang , Da-Jung Chen , Tsung-Chan Wu
- Applicant: Bau-Ru Lu , Kai-Peng Chiang , Da-Jung Chen , Tsung-Chan Wu
- Applicant Address: TW Hsin-Chu
- Assignee: Cyntec Co., Ltd.
- Current Assignee: Cyntec Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW099127794A 20100819
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/31 ; H01L23/64 ; H01L23/495 ; H01L23/00
Abstract:
A method for making an electronic package structure is provided which comprises: providing a substrate; providing an inductor module; assembling the inductor module and the substrate so that they define a space; injecting package glue into the space defined by the inductor module and the substrate so as to form a package layer.
Public/Granted literature
- US20120044656A1 ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME Public/Granted day:2012-02-23
Information query
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