Invention Grant
- Patent Title: Polypeptide linker and method of analyzing target material using the same
- Patent Title (中): 多肽接头和使用其分析目标材料的方法
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Application No.: US13768988Application Date: 2013-02-15
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Publication No.: US08911954B2Publication Date: 2014-12-16
- Inventor: Kyung-yeon Han , Yeon-jeong Kim , Jae-il Lee , Jeong-gun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2012-0095001 20120829
- Main IPC: G01N33/53
- IPC: G01N33/53 ; C07K16/46 ; C07K16/30

Abstract:
A polypeptide linker comprising an antibody-binding region and an enzyme cleavage region, and related compositions, kits, and methods of using same.
Public/Granted literature
- US20140065645A1 POLYPEPTIDE LINKER AND METHOD OF ANALYZING TARGET MATERIAL USING THE SAME Public/Granted day:2014-03-06
Information query
IPC分类: