发明授权
- 专利标题: Hole forming method and laser processing apparatus
- 专利标题(中): 孔成型方法和激光加工装置
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申请号: US13592974申请日: 2012-08-23
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公开(公告)号: US08912464B2公开(公告)日: 2014-12-16
- 发明人: Hiroshi Morikazu
- 申请人: Hiroshi Morikazu
- 申请人地址: JP Tokyo
- 专利权人: Disco Corporation
- 当前专利权人: Disco Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Greer Burns & Crain Ltd.
- 优先权: JP2011-182358 20110824
- 主分类号: B23K26/03
- IPC分类号: B23K26/03 ; B23K26/40 ; B23K26/00 ; B23K26/36 ; B23K26/06 ; B23K26/08 ; B23K26/38 ; H01L21/768
摘要:
A laser processed hole is formed in a workpiece. The workpiece has a first member formed of a first material bonded to a second member formed of a second material. A value is set representing the minimum number of shots of a pulsed laser beam when the spectral wavelength of plasma has changed from the spectral wavelength inherent in the first material to that of the second material. A maximum shot number is set representing a maximum value of the number of beam shots when the spectral wavelength of the plasma has completely changed. The beam is stopped if the number of shots has reached the minimum value and the spectral wavelength of the plasma has changed whereas the beam is continued until the number of shots reaches the maximum value if the spectral wavelength of the plasma has not changed even after the number of shots has reached the minimum value.
公开/授权文献
- US20130048617A1 HOLE FORMING METHOD AND LASER PROCESSING APPARATUS 公开/授权日:2013-02-28
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