Invention Grant
- Patent Title: Connector assembly with integrated pitch translation
- Patent Title (中): 具有集成音调翻译的连接器组件
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Application No.: US13826998Application Date: 2013-03-14
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Publication No.: US08915747B2Publication Date: 2014-12-23
- Inventor: Gaurav Chawla , Rajasekaran Raja Swaminathan , Donald T. Tran
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/71

Abstract:
This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.
Public/Granted literature
- US20140273555A1 CONNECTOR ASSEMBLY WITH INTEGRATED PITCH TRANSLATION Public/Granted day:2014-09-18
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