公开(公告)号：US09640880B2

公开(公告)日：2017-05-02

申请号：US14651820

申请日：2014-07-01

Applicant: Intel Corporation

Inventor： Donald T. Tran ,  Jeffrey Lee ,  Gaurav Chawla

IPC: H01R12/53 ,  H01R9/03 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

CPC classification number: H01R12/53 ,  H01R9/035 ,  H01R9/038 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

公开(公告)号：US20160276759A1

公开(公告)日：2016-09-22

申请号：US14651820

申请日：2014-07-01

Applicant: INTEL CORPORATION

Inventor： Donald T. Tran ,  Jeffrey Lee ,  Gaurav Chawla

IPC: H01R12/53 ,  H01R13/6594 ,  H01R13/6592 ,  H01R13/6593

CPC classification number: H01R12/53 ,  H01R9/035 ,  H01R9/038 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

Abstract translation: 一种电缆连接器，包括具有多个导电焊盘和至少一个接地焊盘的衬底。 电缆连接器还包括双轴向电缆，其包括第一导体和第二导体，围绕第一导体的第一绝缘体和围绕第二导体的第二绝缘体。 双轴向电缆还包括围绕第一和第二绝缘体的接地屏蔽。 第一导体电连接到一个导电焊盘，并且第二导体电连接到另一个导电焊盘。 接地屏蔽电气连接到接地垫。 屏蔽结构安装在基板上并电连接到接地垫。 屏蔽结构包括盖和从盖到基板延伸的多个侧壁。 双轴向电缆位于侧壁之间。

公开(公告)号：US20160268710A1

公开(公告)日：2016-09-15

申请号：US14642078

申请日：2015-03-09

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Gaurav Chawla ,  Rajasekaran Swaminathan ,  Kemal Aygun ,  Li Sun

IPC: H01R12/70 ,  H01R43/20

CPC classification number: H01R12/7076 ,  H01R43/205 ,  H05K7/1038

Abstract: Embodiments of the present disclosure are directed towards a snap connector for socket assembly and associated techniques and configurations. In one embodiment, a socket assembly includes a socket body having a plurality of openings extending from a first side of the socket body to a second side of the socket body to provide an electrical pathway between the first side and the second side, the second side disposed opposite to the first side, wherein a holding portion of an individual opening of the plurality of openings adjacent to the first side of the socket body is shaped to hold a corresponding electrical contact of a die package by elastic force applied by the socket body to the electrical contact when the electrical contact is positioned within the holding portion. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于插座组件和相关技术和配置的卡扣连接器。 在一个实施例中，插座组件包括插座主体，该插座主体具有从插座本体的第一侧延伸到插座主体的第二侧的多个开口，以在第一侧和第二侧之间提供电路径，第二侧 与所述第一侧相对设置，其中所述多个开口的与所述插座主体的第一侧相邻的开口的保持部分成形为通过由所述插座主体施加的弹力来保持模具组件的对应电接触， 当电触点位于保持部分内时的电接触。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09385444B2

公开(公告)日：2016-07-05

申请号：US14132924

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Vijaykumar Krithivasan ,  Gaurav Chawla ,  Joshua D. Heppner ,  Jeffory L. Smalley

IPC: H01R4/50 ,  H01R13/447 ,  H05K1/18 ,  H01R12/71

CPC classification number: H01R4/5066 ,  H01R12/714 ,  H01R13/447 ,  H05K1/181 ,  H05K2201/10325 ,  H05K2201/10719 ,  Y10T29/49204

Abstract: An apparatus comprises a socket for an integrated circuited (IC), wherein the socket includes a socket body that includes a plurality of land grid array contacts for contacting the IC, an alignment mechanism, and a locking mechanism, and a cover for the socket, wherein the cover is vertically alignable with the alignment mechanism of the socket body and laterally slidable over the grid array contacts upon alignment to engage the locking mechanism of the socket body.

Abstract translation: 一种装置包括用于集成电路（IC）的插座，其中插座包括插座主体，其包括用于接触IC的多个平台格栅阵列触点，对准机构和锁定机构以及用于插座的盖， 其中所述盖子与所述插座主体的对准机构垂直对准，并且在对准时可横向滑动在所述格栅阵列上方，以接合所述插座主体的锁定机构。

公开(公告)号：US20160183375A1

公开(公告)日：2016-06-23

申请号：US14578037

申请日：2014-12-19

Applicant: Intel Corporation

Inventor： Vijaykumar Krithivasan ,  Jeffory L. Smalley ,  David J. Llapitan ,  Gaurav Chawla ,  Mani Prakash ,  Susan F. Smith

IPC: H05K1/18 ,  H01L23/40 ,  H01L23/498 ,  B23P15/26 ,  H01L21/48 ,  H05K3/32 ,  H05K7/20 ,  H01L23/367 ,  H01L21/50

CPC classification number: H05K7/2039 ,  H01L23/32 ,  H01L23/36 ,  H01L23/40 ,  H01L2924/0002 ,  H05K2201/10378 ,  H05K2201/1056 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例针对套接字加载元件和相关联的技术和配置。 在一个实施例中，设备可以包括加载元件，该加载元件被配置为将压缩负载从散热器传送到插座组件，其中所述加载元件构造成当所述加载元件与设置在 模具和插座组件，并且其中装载元件包括构造成容纳模具的开口。 可以描述和/或要求保护其他实施例。

公开(公告)号：US10852495B2

公开(公告)日：2020-12-01

申请号：US15746792

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shawna Liff ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Gaurav Chawla

IPC: G02B6/42 ,  G06F13/14 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00 ,  H04M9/06 ,  G06F13/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US10205292B2

公开(公告)日：2019-02-12

申请号：US15716356

申请日：2017-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/498

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

公开(公告)号：US09615483B2

公开(公告)日：2017-04-04

申请号：US14484896

申请日：2014-09-12

Applicant: Intel Corporation

Inventor： Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Michael Garcia ,  Kuang C. Liu ,  Rajasekaran Swaminathan

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433

CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

公开(公告)号：US09490560B2

公开(公告)日：2016-11-08

申请号：US14576735

申请日：2014-12-19

Applicant: INTEL CORPORATION

Inventor： Gaurav Chawla ,  David J. Llapitan ,  Jeffory L. Smalley ,  Tejinder Pal Aulakh ,  Vijaykumar Krithivasan ,  Donald T. Tran

IPC: H01R12/79 ,  H05K7/10 ,  H01R43/20 ,  G06F1/18

CPC classification number: H01R12/79 ,  G06F1/18 ,  H01R43/205 ,  H05K7/1069 ,  H05K7/1092

Abstract: A connector for a multi-array bottom side array is described that uses a spring bias. In one example, a connector includes a connector housing, the connector housing having a bottom surface, and a plurality of resilient connectors opposite the bottom surface to electrically connect to a corresponding plurality of pads of an integrated circuit package, a cable connector to electrically connect the resilient connectors to a cable, a base plate having a bottom surface to press against a circuit board, and a top surface opposite the bottom surface, and plurality of spring members coupled between the base plate and the connector bottom surface to press the base plate bottom surface against the system board and to press the connector housing connectors against the package.

Abstract translation: 描述了使用弹簧偏压的多阵列底侧阵列的连接器。 在一个示例中，连接器包括连接器壳体，连接器壳体具有底表面，以及与底表面相对的多个弹性连接器，以电连接到集成电路封装的对应的多个焊盘;电缆连接器，用于电连接 电缆的弹性连接器，具有压靠电路板的底表面的基板和与底表面相对的顶表面，以及联接在基板和连接器底表面之间的多个弹簧构件，用于将基板 底部表面靠在系统板上，并将连接器外壳连接件按压在包装上。

公开(公告)号：US09478881B2

公开(公告)日：2016-10-25

申请号：US14642078

申请日：2015-03-09

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Gaurav Chawla ,  Rajasekaran Swaminathan ,  Kemal Aygun ,  Li Sun

IPC: H01R13/193 ,  H01R12/51 ,  H01R12/70 ,  H01R43/20

CPC classification number: H01R12/7076 ,  H01R43/205 ,  H05K7/1038

Abstract: Embodiments of the present disclosure are directed towards a snap connector for socket assembly and associated techniques and configurations. In one embodiment, a socket assembly includes a socket body having a plurality of openings extending from a first side of the socket body to a second side of the socket body to provide an electrical pathway between the first side and the second side, the second side disposed opposite to the first side, wherein a holding portion of an individual opening of the plurality of openings adjacent to the first side of the socket body is shaped to hold a corresponding electrical contact of a die package by elastic force applied by the socket body to the electrical contact when the electrical contact is positioned within the holding portion. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例涉及用于插座组件和相关技术和配置的卡扣连接器。 在一个实施例中，插座组件包括插座主体，该插座主体具有从插座本体的第一侧延伸到插座主体的第二侧的多个开口，以在第一侧和第二侧之间提供电路径，第二侧 与所述第一侧相对设置，其中所述多个开口的与所述插座主体的第一侧相邻的开口的保持部分成形为通过由所述插座主体施加的弹力来保持模具组件的对应电接触， 当电触点位于保持部分内时的电接触。 可以描述和/或要求保护其他实施例。