发明授权
- 专利标题: Polymeric fused thiophene semiconductor formulation
- 专利标题(中): 聚合稠合噻吩半导体配方
-
申请号: US13093279申请日: 2011-04-25
-
公开(公告)号: US08916066B2公开(公告)日: 2014-12-23
- 发明人: Mingqian He , Jianfeng Li , Jen-Chieh Lin , James Robert Matthews , Weijun Niu , Michael Lesley Sorensen
- 申请人: Mingqian He , Jianfeng Li , Jen-Chieh Lin , James Robert Matthews , Weijun Niu , Michael Lesley Sorensen
- 申请人地址: US NY Corning
- 专利权人: Corning Incorporated
- 当前专利权人: Corning Incorporated
- 当前专利权人地址: US NY Corning
- 代理商 John L. Haack
- 主分类号: H01B1/00
- IPC分类号: H01B1/00 ; C08G75/00 ; C09D11/36 ; C08K5/01 ; C08L65/00
摘要:
A formulation including: an organic semiconducting material; and a carrier liquid including at least one of: a first liquid of the formulas (III) or (II): or mixtures of formulas (III) and (II); and a second liquid of a saturated or unsaturated cyclic hydrocarbylene compound of the formula (I): where the respective R1-8, x, and n are as defined herein, and optionally a tertiary liquid carrier, as defined herein. Also disclosed are semiconducting articles prepared with the formulations as defined herein.
公开/授权文献
- US20110291054A1 POLYMERIC FUSED THIOPHENE SEMICONDUCTOR FORMULATION 公开/授权日:2011-12-01
信息查询