发明授权
- 专利标题: Cavities containing multi-wiring structures and devices
- 专利标题(中): 包含多层结构和设备的腔
-
申请号: US13296785申请日: 2011-11-15
-
公开(公告)号: US08916781B2公开(公告)日: 2014-12-23
- 发明人: Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
- 申请人: Belgacem Haba , Ilyas Mohammed , Craig Mitchell , Cyprian Emeka Uzoh
- 申请人地址: US CA San Jose
- 专利权人: Invensas Corporation
- 当前专利权人: Invensas Corporation
- 当前专利权人地址: US CA San Jose
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/03 ; H05K1/09 ; H05K1/00 ; H01L23/498 ; H01R12/71 ; H05K3/42
摘要:
An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.
公开/授权文献
- US20130122747A1 CAVITIES CONTAINING MULTI-WIRING STRUCTURES AND DEVICES 公开/授权日:2013-05-16
信息查询