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US08916781B2 Cavities containing multi-wiring structures and devices 有权
包含多层结构和设备的腔

Cavities containing multi-wiring structures and devices
摘要:
An interconnection component includes an element with an opening, a plurality of conductors electrically insulted from one another extending through the opening, and a plurality of second contacts electrically insulated from one another. The element is comprised of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. At least some of the conductors extend along at least one inner surface of the opening. The conductors define a plurality of wettable first contacts at the first surface. The first contacts are at least partially aligned with the opening in a direction of the thickness and electrically insulated from one another.
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