Invention Grant
- Patent Title: Defect inspection method and defect inspection apparatus
- Patent Title (中): 缺陷检查方法和缺陷检查装置
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Application No.: US13976178Application Date: 2011-10-21
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Publication No.: US08922764B2Publication Date: 2014-12-30
- Inventor: Yuta Urano , Toshifumi Honda , Yukihiro Shibata
- Applicant: Yuta Urano , Toshifumi Honda , Yukihiro Shibata
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP
- Priority: JP2010-289127 20101227
- International Application: PCT/JP2011/005899 WO 20111021
- International Announcement: WO2012/090367 WO 20120705
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G01N21/95 ; G01B11/06 ; G01N21/88

Abstract:
A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.
Public/Granted literature
- US20130301042A1 DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS Public/Granted day:2013-11-14
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